Understanding mechanical tolerances, coaxial design details and connector materials used in cable assemblies helps
produce communications equipment with the lowest levels of passive intermodulation (PIM).
This paper discusses the setup details for the demo shown in this video Head to Head: NI 5665 vs. Traditional Boxed Instruments. The demo compares the performance and speed of the NI PXIe-5665 with the Agilent PXA. Rather than comparing the datasheet specifications of both instruments, this video compares the two instruments while performing real- world test scenarios.
RF laterally diffused MOS (LDMOS) is currently the dominant device technology used in high-power RF power amplifier (PA) applications for frequencies ranging from 1 MHz to greater than 3.5 GHz. This paper will include device and design considerations that specifically target enhancing ruggedness performance. The features of the products using this platform will also be presented.
Considered problem is the reading of multiple RFID tags in the region of space, which is bounded by metal walls and has resonant radio-engineering properties. Obtained results show that it is possible to get reliable automated monitoring of items with tags by forming of a local electromagnetic field (EMF) with the help of slow-wave structures (SWS).
This white paper examines the use of envelop tracking, digital pre-distortion and impedance matching via load-pull to improve the efficiency and linearity performance of RF power amplifliers targeting 4G and 5G applications.
Learn practical strategies to overcome RF and microwave interference challenges in the field using real-time spectrum analysis (RTSA). Read about the different types of interference encountered in both commercial and aerospace defense (A/D) wireless communication networks. Uncover the drawbacks associated with traditional interference analysis and get an in-depth introduction to RTSA. Plus, see why this type of analysis is required to troubleshoot interference in today’s networks with bursty and elusive signals.
This whitepaper provides an overview of beamforming technology and a brief summary of application trends and evolving design considerations. Within this context, the second half of the paper explores how new high--‐performance modular DSP--‐based beamforming subsystems can help meet the emerging and future requirements for speed, functionality, configuration flexibility and software programmability, along with a lower cost of deployment and lifecycle maintainability.
This whitepaper demonstrates how XFdtd's time-domain EM simulation enables rapid development by analyzing the performance of a fully detailed sensor model installed behind a piece of fascia without needing to build prototypes and run tests in an anechoic chamber. The analysis of a 25 GHz sensor frames the discussion.
When designing a high performance data acquisition system, a significant decision is what chassis form factor to use. A rackmount 19 inch chassis comes to mind as a good generic solution, and the PXIe version seems like a good candidate as it is standardized, reasonably priced, and available from multiple vendors. The only significant concern is that native PXI/PXIe modules are generally aimed at the testing market, which means they tend to have lower throughput, with less processing power than needed in high performance data acquisition systems.
The test process for complete wireless systems, subsystems, and components is very complex. Ensuring successful testing from design optimization, troubleshooting, and validation through wireless standards compliance, in a way that is time- and cost-efficient, requires a comprehensive test approach. Download this application article plus 3 others in the latest edition of the Keysight Application Solution Guide.
RF test systems must efficiently handle complex signals and address a variety of standards. This application note will help you match your test priorities with the most efficient PXI software tools available, from instrument drivers to standard-specific measurement applications, to advanced modulation analysis and resource optimization tools.
Electromagnetic (EM) simulation is an indispensable tool for characterizing the on-chip passive structures found in radio-frequency integrated circuit (RFIC) designs. However, when it comes to full-chip analysis, the diversity of structure geometries and scale pose a significant challenge for any single EM simulation technology. Successful characterization of an RFIC generally requires three different types of simulators: parasitic extraction, planar EM, and full (arbitrary) 3D solvers.
Engineers often source instruments from different suppliers and mechanical, electrical and software compatibility is essential for successful operation. Get the application note which provides tips on how to select everything from PXI modules to software to ensure compatibility.