Boonton, a Wireless Telecom Group company, introduced the new RTP4000 series of Real-Time True Average Power sensors. These sensors deliver a dynamic range from -60 to +20 dBm, a frequency range down to 6 kHz and an industry leading measurement rate of 100,000 measurements per second. Built with Boonton’s Real-Time Power Processing™ technology which eliminates gaps in acquisition and provides zero measurement latency, RTP4000 sensors deliver lightning-fast performance in a compact USB form factor.
T-Tech Inc. the manufacturer of the Quick Circuit rapid prototyping system announces CNC2PCB®. The new software application allows you to output your DXF data, Gerber data, or NC Drill data to computer numerical control programs. By following the EIA RS-274 industry standard, the output from CNC2PCB allows you to fabricate your PCB or chassis on your milling center in your mechanical engineering department.
The agenda has been set and registration opened for the sixth annual combined AWR Design Forum (ADF 2016) and NI AWR Software User Group meeting, being held during European Microwave Week (EuMW 2016) October 4-6 in London. ADF 2016 takes place on October 4 from 12:00 p.m. to 4:00 p.m. in ICC Capital Suite, Room 6 on Level 3.
Modelithics Inc. and IPDiA, have teamed up to develop Modelithics models for IPDiA’s high performance ultra broadband surface mount silicon capacitor. Modelithics and IPDiA worked closely as part of the Modelithics Vendor Partner (MVP) Program to characterize the 10 nF low profile (100 µm) capacitor (UBSC 935 152 492 510).
The organizers of COMSOL Conference 2016 Boston are proud to announce this year’s keynote speakers. The COMSOL Conference is held worldwide in seven major cities. It attracts thousands of engineers and scientists with its focus on multiphysics simulation and application design. The first event is taking place in Boston on October 5-7 and features the following line up of distinguished modeling and simulation professionals.
Tech-X Corp. will exhibit at EDI CON USA 2016 , taking place in Boston, Mass., September 20-22. Stop by Booth #123 to learn about Vsim finite difference time domain (FDTD) electromagnetic (EM) and particle-in-cell (PIC) simulation. Applications include magnetron sputtering, helix traveling wave tubes (TWTs) klystrons, gyrotrons, plasma physics and antennas.
NI AWR Design Environment will be featured in the third annual NI-sponsored RF/Microwave Power Amplifier Forum being held during European Microwave Week (EuMW 2016), October 4-6 in London. Entitled Device Technologies, Characterization, Modeling and End-Use Applications, the forum takes place on Wednesday, October 5 from 9:30 a.m. to 2:00 p.m. in Room 6, Conference Area Level 3.
With the latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.
The Weightless SIG announced availability of Weightless-P hardware and the pre-launch of a Weightless-P Software Development Kit. In conjunction with Weightless Vendor partner, Antenova, Weightless-P hardware is to be shown at CTIA SuperMobility in Las Vegas, September 7-9. A limited number of free Weightless-P SDKs will be made available to developers in an offer specific to the show.
Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.
This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.
RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.