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Software/EDA Channel

Software/EDA related topics

ARTICLES

ANSYS 17.2 boosts simulation accuracy and productivity for next-generation product development

Engineers can now create next-generation products easier, faster and more economically with advances across the ANSYS engineering simulation portfolio. Available today, ANSYS 17.2 offers a wealth of new functionality, including enhanced multiphysics coupling, new workflows for antenna design and automated temperature characteristics for electric machines.


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Latest version of LabVIEW Communications drives rapid prototyping for 5G

NI, the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges,announced LabVIEW Communications System Design Suite 2.0, a development environment specifically designed for prototyping wireless communications systems. This new version adds NI Linux Real-Time capability for all software defined radio (SDR) products including the NI USRP RIO and FlexRIO.


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COMSOL invites to participate in the COMSOL App Contest

Comsol Multiphysics GmbH invites engineers, scientists, researchers and students to participate in the COMSOL App Contest. Whether you are new into simulation or experienced in using COMSOL Multiphysics, an application expert or a student the App Contest is the platform to share your experience with a great community. The App Contest is a chance to learn how to create an App, improve App building skills and compete with other App designers.


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Dassault Systèmes to acquire CST

Dassault Systèmes, the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, announced it has entered into a definitive agreement to acquire CST - Computer Simulation Technology AG, the technology leader in electromagnetic (EM) and electronics simulation, for approximately 220 million euros.


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EVENTS

Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO Short Course

Bothell, WA
United States

Training/User Meetings

CST Workshops and Trainings

CST
CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

FEKO Webinar Series 2015

7/28/15

We have covered some very interesting topics so far this year and the recordings of each is available here.  To keep up to date with our webinars subscribe to our bi-monthly newsletter and updates.

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Overview of FEKO Suite 7.0

12/29/20

EMSS-FEKO
Technical Education Webinar Series

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FEKO WEBINAR SERIES 2014

12/30/20

Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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2013 FEKO Webinar Archive

12/31/20

A wide range of topics were covered in this series. The hour long webinars were presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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DOCUMENTS AND FILES

Co-Simulation With Visual System Simulator and LabVIEW for Enhanced Signal Processing

This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.

Discover a Streamlined Path to Record and Playback

RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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