The Altair Partner Alliance(APA) added systems engineering software from XLDyn, LLC to its lineup of software partnerships. The software is made up of two modules, XLSE and XL1D, which work together to automate the creation of system models and perform one dimensional (1D) multi-physics simulations.
Engineers can now create next-generation products easier, faster and more economically with advances across the ANSYS engineering simulation portfolio. Available today, ANSYS 17.2 offers a wealth of new functionality, including enhanced multiphysics coupling, new workflows for antenna design and automated temperature characteristics for electric machines.
NI, the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges,announced LabVIEW Communications System Design Suite 2.0, a development environment specifically designed for prototyping wireless communications systems. This new version adds NI Linux Real-Time capability for all software defined radio (SDR) products including the NI USRP RIO and FlexRIO.
Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter wave devices, announces the availability of new Microwave Global Models™ for Passive Plus 0505C and 1111C surface mount chip capacitor families.
Marvin Test Solutions Inc., a trusted provider of globally-deployed innovative test solutions for military, aerospace, and manufacturing organizations, is marking the silver anniversary of ATEasy, its evolutionary test software suite, first released in 1991 and now in its ninth generation.
Comsol Multiphysics GmbH invites engineers, scientists, researchers and students to participate in the COMSOL App Contest. Whether you are new into simulation or experienced in using COMSOL Multiphysics, an application expert or a student the App Contest is the platform to share your experience with a great community. The App Contest is a chance to learn how to create an App, improve App building skills and compete with other App designers.
Dassault Systèmes, the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, announced it has entered into a definitive agreement to acquire CST - Computer Simulation Technology AG, the technology leader in electromagnetic (EM) and electronics simulation, for approximately 220 million euros.
Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.
This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.
RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.