Keysight Technologies, Inc. announced comprehensive pulsed radar analysis software. The new 89600 VSA software’s pulse analysis option (BHQ) is used in radar and electronic counter measure applications for capturing and analyzing threats and jamming responses.
COMSOL, Inc. announced the release of COMSOL Server™, a new product developed specifically for running applications built with the Application Builder. Released earlier this year, the Application Builder allows COMSOL Multiphysics® software users to build an intuitive interface around their COMSOL model that can be run by anyone — even those without prior simulation experience.
National Instruments (NI), provider of solutions that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the LabVIEW Communications System Design Suite, which combines software defined radio(SDR) hardware with a comprehensive software design flow to help engineers prototype 5G systems.
Modelithics, Inc., in partnership with TriQuint Semiconductor, has released the latest update to the growing library of high-accuracy non-linear simulation models for TriQuint gallium nitride (GaN) transistors.
Intercept Technology Inc. announced the availability of a new and improved low cost electromagnetic compatibility (EMC) solution. The software solution pairs the EMSAT post-layout EMC and SI design rule checkers, developed by IBM® and sold through Moss Bay EDA, with a customized Pantheon EMSAT viewer that displays each violation on the board in real-time.
FilterSolutions® the filter circuit synthesis software from Nuhertz Technologies has added the capability of exceptionally rapid and accurate electromagnetic (EM) optimization utilizing Axiem® tuning port capability, the electromagnetic analysis tool from NI/AWR® (division of National Instruments Corp.).
COMSOL Multiphysics users are already building applications and exploring the benefits of sharing their models with colleagues and customers worldwide. Arkansas Power Electronics Intl. (APEI) introduces the first multiphysics simulation app built with COMSOL's Application Builder.
The new R&S RTO-K26 MIPI D-PHY compliance test software from Rohde & Schwarz offers automated tests in line with the current v1.1 specifications of the MIPI® Alliance and the University of New Hampshire InterOperability Laboratory (UNH-IOL).
Computer Simulation Technology AG (CST) presented new features for EDA simulation in CST STUDIO SUITE 2015 at Electronica 2014, including a new tetrahedral meshing algorithm and Pareto frontier optimization for decoupling capacitors.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.