NI AWR Design Environment™ will be showcased in a slate of activities at the International Microwave Symposium (IMS) 2016, taking place in San Francisco May 22-27. A number of NI AWR software demonstrations on load-pull and radar systems, as well as antenna design and third-party integration flows will be on display in Booth #1529. Also being showcased is AntSyn™, a new, cloud-based software as a service (SaaS) antenna synthesis and optimization solution that enables designers to input their antenna engineering requirements and produce antenna designs as outputs.
Engineers at BE CAE & Test (Catania, Italy) have taken the simulation process well beyond the typical approach of “run a test / deliver a report.” Instead, using the COMSOL Multiphysics software and the Application Builder, they have created a series of easy-to-use custom applications that perform state-of-the-art virtual prototyping of their customers’ surface-mount device designs. The apps hide the complexity of the underlying detailed model, yet still provide access to the powerful functionality of the simulation.
Altair has acquired AWE Communications GmbH (AWE) based in Gärtringen, Germany. AWE was founded in 1998 as a spin-off from the University of Stuttgart and the main focus has been the development of the WinProp Software Suite for wave propagation and radio network planning.
NI announces that NI AWR Design Environment™ V12 will be highlighted at the Electronic Design Innovation Conference (EDI CON) 2016, being held in Beijing, China April 19-21. In addition to demonstrations in NI Booth #315, the software will be featured in two 40-minute workshops.
Altair invites engineering students from across the globe to participate in the 14th annual FEKO Student Competition. The competition is open to all students who work on a supervised project in electromagnetic engineering and make use of FEKO, Altair's HyperWorks solution for electromagnetic simulation.
Mentor Graphics Corp. announced its newest HyperLynx® release which integrates signal and power integrity analysis, 3D-electromagnetic solving, and fast rule checking into a single unified environment.
Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter-wave devices, has just released a new version of The Modelithics® COMPLETE Library, version 16.0, formatted for use with Keysight EEsof EDA Advanced Design System (ADS) simulation software from Keysight Technologies.
Anritsu Co. introduces software packages for its all-in-one Radio Communication Analyzer MT8821C that support LTE-Advanced UE Downlink (DL) 4x4 MIMO and Downlink Carrier Aggregation (DL CA) 5CCs. The new software packages further strengthen the test functionality of the MT8821C and help create a single-instrument solution that can speed time to market and lower test costs of LTE-Advanced chipsets, smartphones, tablets and M2M modules used in IoT applications.
Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.
This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.
RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.