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Software/EDA Channel

Software/EDA related topics


COMSOL releases latest version of software for creating simulation apps

COMSOL Inc. brings to the simulation community the only fully integrated environment for creating simulation apps by announcing the pre-release of COMSOL Multiphysics 5.2 at the COMSOL Conference 2015 Boston. As the leading provider of multiphysics modeling and simulation software, COMSOL delivers major productivity updates to COMSOL Multiphysics and COMSOL Server with new features, improved stability and robustness, and faster execution. 

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COMSOL announces new Focus Sessions for Boston 2015 COMSOL Conference

COMSOL, the leading provider of multiphysics modeling and simulation software, is pleased to announce the new Focus Sessions and Training Sessions that will be featured at the 11th Annual COMSOL Conference, the world’s largest event for multiphysics simulation and application design. Each session provides attendees with an in-depth look at how to get the most out of modeling.

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Keysight donates EDA Software to South Korea’s Chungnam National University

Keysight Technologies Inc. announced its donation of Keysight EDA software to Chungnam National University (CNU) in Daejeon, South Korea, as part of the Keysight EEsof EDA University Educational Support Program. This is the third software donation this year, following earlier donations to South Korea’s Sogang and Dongguk Universities, and is intended to help CNU foster well-rounded electronics engineering experts.

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Training/User Meetings

COMSOL Training Courses

Training/User Meetings

CST Workshops and Trainings

CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

FEKO Webinar Series 2015


We have covered some very interesting topics so far this year and the recordings of each is available here.  To keep up to date with our webinars subscribe to our bi-monthly newsletter and updates.

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Trade Shows Training/User Meetings

NIDays London 2015

The Queen Elizabeth II Conference Centre
United Kingdom

Graphical System Design Conference

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Antenna Simulation with COMSOL®


COMSOL blue logo

Technical Education Webinar Series

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Trade Shows

DesignCon 2016

Santa Clara Convention Center
Santa Clara, CA
United States

Overview of FEKO Suite 7.0


Technical Education Webinar Series

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Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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Discover a Streamlined Path to Record and Playback

RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.


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