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Software/EDA Channel

Software/EDA related topics


Isola offers free impedance and power-handling calculator

July 29, 2014

 Isola Corp. is pleased to announce a free Impedance and Power-Handling Calculator that predicts the design attributes for microstrips and striplines based on the design’s target impedance and dielectric properties of the company’s RF, microwave and millimeter-wave laminate materials. 

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Agilent offers Modelithics COMPLETE library for new Genesys 2014 users

July 28, 2014

 Agilent Technologies Inc. announced that the Modelithics COMPLETE library of RF and microwave component model libraries is available free of charge for six months to Genesys 2014 users new to Modelithics. 

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Analyst update in NI AWR software dramatically reduces simulation times

July 22, 2014

 NI (formerly AWR Corporation) has released V11.01 of the NI AWR Design Environment™ with enhancements to Analyst™ 3D finite element method (FEM) EM simulation engine that cuts simulation times by as much as 70 percent over previous versions.  

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Optenni Lab 3.0 available through CST sales channels

July 21, 2014

Computer Simulation Technology has announced the availability of Optenni Lab 3.0 through the worldwide CST sales network.

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3D EM Solver

July 14, 2014

Mentor Graphics expands automotive portfolio, acquires XS Embedded

July 10, 2014

Mentor Graphics Corp. announced the acquisition of XS Embedded GmbH (XSe), a technology leader in the creation of automotive system architectures and hardware reference platforms. 

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Tech-­X Corp. releases VSim 7

July 8, 2014

 Tech-X Corp. announces the release of VSim 7, an electromagnetic time-domain three-dimensional solver with particle and plasma simulation capabilities.  

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Antenna Magus Version 5.0 released

July 4, 2014

MAGUS (Pty) Ltd and Computer Simulation Technology AG (CST) have announced the release of Antenna Magus Version 5.0.

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Univ. of Alberta graduate student designs GFETs with NI AWR software

July 1, 2014

NI (formerly AWR Corp.) has published a new success story detailing how a University of Alberta, Canada graduate student successfully developed a modified top-of-the-barrier model for graphene field-effect transistors (GFETs) using NI AWR Design Environment™/Microwave Office® circuit design software.  

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CST Workshops and Trainings


CST Workshops and Trainings

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RF/Microwave Design for MMICs, MCMs and Hybrid Modules

December 17, 2013
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

June 14, 2013
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

December 15, 2012
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

June 1, 2012
Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.


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