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Software/EDA Channel

Software/EDA related topics

ARTICLES

AWR Connected for ANSYS expands to tie HFSS S-parameters into Microwave Office software

AWR Connected™ for ANSYS now offers an integrated two-way link between ANSYS® HFSS™ and NI AWR Design Environment™, specifically Microwave Office circuit design software, enabling RF/microwave designers to seamlessly tie HFSS extracted S-parameters back into NI AWR software. This integration unites two industry-standard design tools, HFSS full-wave electromagnetic (EM) field simulation and Microwave Office, to quickly and accurately simulate microwave circuits.


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Keysight, Georgia Tech announce plan to launch Keysight Software Development Center

Keysight Technologies Inc. and the Georgia Institute of Technology (Georgia Tech) announced a plan to launch a Keysight software development center to accelerate Keysight’s transformation into a software-centric solutions provider. Keysight has chartered the center to develop next-generation software for use in the design and test of electronic products being created by Keysight’s customers around the world.


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Qorvo unveils new SDK to accelerate deployment of smart home gateways

Qorvo®, a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, announced the availability of a ZigBee 3.0 software development kit (SDK) for Smart Home gateways that incorporate the new GP712 radio communication controller chip from GreenPeak Technologies (now the Low Power Wireless business unit of Qorvo).


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NI AWR Software showcased in slate of activities at IMS2016

NI AWR Design Environment™ will be showcased in a slate of activities at the International Microwave Symposium (IMS) 2016, taking place in San Francisco May 22-27. A number of NI AWR software demonstrations on load-pull and radar systems, as well as antenna design and third-party integration flows will be on display in Booth #1529. Also being showcased is AntSyn™, a new, cloud-based software as a service (SaaS) antenna synthesis and optimization solution that enables designers to input their antenna engineering requirements and produce antenna designs as outputs.


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Simulation apps create new business opportunities for engineers at BE CAE & Test

Engineers at BE CAE & Test (Catania, Italy) have taken the simulation process well beyond the typical approach of “run a test / deliver a report.” Instead, using the COMSOL Multiphysics software and the Application Builder, they have created a series of easy-to-use custom applications that perform state-of-the-art virtual prototyping of their customers’ surface-mount device designs. The apps hide the complexity of the underlying detailed model, yet still provide access to the powerful functionality of the simulation.


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EVENTS

Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO Short Course

Bothell, WA
United States

Training/User Meetings

CST Workshops and Trainings

CST
CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

FEKO Webinar Series 2015

7/28/15

We have covered some very interesting topics so far this year and the recordings of each is available here.  To keep up to date with our webinars subscribe to our bi-monthly newsletter and updates.

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Overview of FEKO Suite 7.0

12/29/20

EMSS-FEKO
Technical Education Webinar Series

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FEKO WEBINAR SERIES 2014

12/30/20

Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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2013 FEKO Webinar Archive

12/31/20

A wide range of topics were covered in this series. The hour long webinars were presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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DOCUMENTS AND FILES

Co-Simulation With Visual System Simulator and LabVIEW for Enhanced Signal Processing

This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.

Discover a Streamlined Path to Record and Playback

RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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