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Software/EDA Channel

Software/EDA related topics

ARTICLES

Keysight introduces Physical Layer Test System Software 2015

Keysight Technologies Inc. introduced N1930B Physical Layer Test System (PLTS) 2015, the latest release of its premier signal integrity test software for designing and validating high-speed digital interconnect.


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CST announces CST EMC STUDIO

Software/EDA

Computer Simulation Technology (CST) announces CST EMC STUDIO, a product for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) analysis.


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Remcom announces PCB model automation for XFdtd EM simulation software

Remcom announces PinBuilder™ electromagnetic model automation for XFdtd® EM Simulation Software. PinBuilder, which automates the creation of pin-field breakout models for XFdtd simulations, will be available in the software later this year.


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HyperLynx Alliance accelerates high-speed design-ins and verification

Mentor Graphics Corp. announced its new HyperLynx® Alliance developed with key industry partners, integrating tools, data and methodology to accelerate new technology adoption.


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Cascade Microtech introduces Velox 2.0 probe station control software

Software/EDA

Cascade Microtech Inc. announced Velox 2.0, the latest version of their probe station control software. Combining the ease of Nucleus™ with the power of ProberBench™, Velox 2.0 delivers new levels of test and measurement efficiency to accelerate time to job completion.


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Keysight Technologies’ PXI VNA wins multiple industry awards

Keysight Technologies Inc. announced that it has received three awards for its recently introduced M937XA PXI Vector Network Analyzer.


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Keysight unveils silicon RFIC interoperability in ADS 2015

Software/EDA

Featuring silicon RFIC interoperability with Cadence’s Virtuoso, GoldenGate-in-ADS and a host of capabilities intended to increase design efficiency, the Keysight EEsof EDA software, ADS 2015, is changing how silicon RFIC and multi-technology module design is performed.


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Keysight donates $120M gift of software, support and training to Georgia Tech

Keysight Technologies, Inc. announced the largest in-kind software donation in its longstanding relationship with the Georgia Institute of Technology.


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Keysight Technologies introduces advanced pulse analysis software

Keysight Technologies, Inc. announced comprehensive pulsed radar analysis software. The new 89600 VSA software’s pulse analysis option (BHQ) is used in radar and electronic counter measure applications for capturing and analyzing threats and jamming responses.


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COMSOL Server now available to run simulation apps

Software/EDA

COMSOL, Inc. announced the release of COMSOL Server™, a new product developed specifically for running applications built with the Application Builder. The Application Builder allows COMSOL Multiphysics® software users to build an intuitive interface around their COMSOL model that can be run by anyone — even those without prior simulation experience.


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EVENTS

Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO events calender

Training/User Meetings

CST Workshops and Trainings

CST
CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

Trade Shows

DesignCon 2015

1/27/15
Santa Clara Convention Center
Santa Clara, CA
United States

DesignCon 2015 logo

Where the chip meets the board

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Webinars

RF and Microwave Heating with COMSOL Multiphysics

2/19/15

COMSOL blue logo

Technical Education Webinar Series

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DOCUMENTS AND FILES

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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