COMSOL Multiphysics users are already building applications and exploring the benefits of sharing their models with colleagues and customers worldwide. Arkansas Power Electronics Intl. (APEI) introduces the first multiphysics simulation app built with COMSOL's Application Builder.
The new R&S RTO-K26 MIPI D-PHY compliance test software from Rohde & Schwarz offers automated tests in line with the current v1.1 specifications of the MIPI® Alliance and the University of New Hampshire InterOperability Laboratory (UNH-IOL).
Computer Simulation Technology AG (CST) presented new features for EDA simulation in CST STUDIO SUITE 2015 at Electronica 2014, including a new tetrahedral meshing algorithm and Pareto frontier optimization for decoupling capacitors.
COMSOL, Inc. redefines the engineering simulation market with the release of COMSOL Multiphysics® software version 5.0, featuring extensive product updates, three new add-on products and the new and revolutionary Application Builder.
Mentor Graphics Corp., released the Xpedition Systems Designer for multi-board systems connectivity. The product captures the hardware description of multi-board systems, from logical system definition to individual PCBs and automates multi-level system design synchronization processes.
Keysight Technologies, Inc. introduced the Keysight EEsof EDA 5G Baseband Exploration Library. Providing ready-to-use reference signal processing intellectual property (IP) for 5G technology research, this industry-first library dramatically increases productivity for system architects and baseband physical layer designers.
Keysight Technologies Inc. announced it will demonstrate its latest RF circuit, system and 3D electromagnetic design and simulation solutions at the Compound Semiconductor IC Symposium (CSICS 2014), Hyatt Regency La Jolla at Aventine, San Diego, California, Oct. 19-22. Keysight EEsof EDA is a silver-level sponsor of the event.
The ChipScan-ESA analysis software from Langer EMV-Technik GmbH has been designed for the clear and comparable recording of a spectrum analyzer's measurement curves (system requirements: Windows XP and later). It allows the user to visualize measuring curves quickly and interactively, perform complex analyses and export the curves easily
Altium Ltd., a global leader in electronic design automation, native 3D PCB design systems (Altium Designer) and embedded software development toolkits (TASKING), announced the upcoming release of its professional printed circuit board (PCB) and electronic system level design software, Altium Designer 15.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.