Remcom announces the release of Wireless InSite® MIMO, a new version of its site-specific radio propagation software that simulates the detailed multipath of large numbers of MIMO channels while overcoming the increased level of computations required for traditional ray tracing methods.
Modelithics and KEMET recently collaborated to develop highly accurate measurement based equivalent circuit models for the KEMET CBR RF capacitor series, including EIA case sizes 0201, 0402, 0603, 0805 and 0505. These models are now available in industry leading simulation tools including Keysight ADS, Keysight Genesys, NI AWR Design Environment, ANSYS HFSS and Sonnet Suites.
Anritsu Co. introduced new software for its Radio Communications Analyzer MT8821C that creates the industry’s first test solution that supports evaluation of 4x4 MIMO 256 QAM RF Rx performance for all DL 3CC CA band combinations with no restrictions on frequency and signal bandwidth combinations. The new software provides wireless chipset and UE manufacturers, as well as mobile operators with a solution to conduct efficient, highly accurate carrier acceptance tests to ensure performance.
Modelithics Inc. is pleased to announce the availability of two new Microwave Global Models™ for Würth Elektronik inductor families. As part of the Modelithics Vendor Partner (MVP) Program, Würth Elektronik and Modelithics collaborated to develop the advanced-feature models that offer substrate scalability, part value scalability and pad scalability.
CST - Computer Simulation Technology AG (CST) previewed the upcoming version of its flagship electromagnetic (EM) simulation tool, CST STUDIO SUITE® 2017, at European Microwave Week 2016. CST STUDIO SUITE is used by engineers, designers and researchers in market-leading companies in industries including automotive, aerospace, defense, electronics, healthcare and telecommunications. CST’s Complete Technology approach to simulation means that CST STUDIO SUITE offers a range of both general purpose and specialized solvers for EM and multiphysics problems in one user-friendly interface
Computer Simulation Technology AG (CST) announces the acquisition of Aurora Software and Testing, SL (AURORASAT), a technology leading provider of tools for the analysis, synthesis and design of passive microwave components.
Boonton, a Wireless Telecom Group company, introduced the new RTP4000 series of Real-Time True Average Power sensors. These sensors deliver a dynamic range from -60 to +20 dBm, a frequency range down to 6 kHz and an industry leading measurement rate of 100,000 measurements per second. Built with Boonton’s Real-Time Power Processing™ technology which eliminates gaps in acquisition and provides zero measurement latency, RTP4000 sensors deliver lightning-fast performance in a compact USB form factor.
Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.
This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.
RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.