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Software/EDA Channel

Software/EDA related topics

ARTICLES

IMS2014 student contest winners awarded NI AWR Design Environment license

Software/EDA
National Instruments (NI)
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NI (formerly AWR Corp.) awarded the first, second and third place winning teams of the IMS2014 Student Design Contest for high-efficiency power amplifier and high-sensitivity radar complementary one-year licenses of NI AWR Design Environment™ software.
 

 


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Keysight's new software test suite for improving power amplifier efficiency

Software/EDA
Keysight Technologies, Inc.
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 Keysight Technologies introduced the N7614B Signal Studio for Power Amplifier (PA) Test; an all-in-one, general-purpose test suite designed to help engineers improve PA efficiency through support for crest factor reduction (CFR), envelope tracking (ET) and digital pre-distortion (DPD) technologies. 


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NI AWR design environment launches e-learning portal

Software/EDA
National Instruments (NI)
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NI (formerly AWR Corp.) has launched the NI AWR Design Environment™ E-Learning Portal to give current users of NI AWR software the ability to learn more about the powerful tools, technologies and applications of the software as their time and interest allows. 

 

 


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Altair expands to South Africa with office in Stellenbosch

Altair
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As a result of the acquisition of EM Software & Systems - S.A. by Altair, the company has gained a local presence in Stellenbosch, South Africa with tremendous depth of industry expertise.


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Huawei signs deal with Ranplan for small cell network planning and optimization

Huawei and Ranplan
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Huawei has signed a global license agreement with Ranplan for planning small cell wireless networks.


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Isola offers free impedance and power-handling calculator

Software/EDA
Isola Group
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 Isola Corp. is pleased to announce a free Impedance and Power-Handling Calculator that predicts the design attributes for microstrips and striplines based on the design’s target impedance and dielectric properties of the company’s RF, microwave and millimeter-wave laminate materials. 


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Agilent offers Modelithics COMPLETE library for new Genesys 2014 users

Agilent Technologies
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 Agilent Technologies Inc. announced that the Modelithics COMPLETE library of RF and microwave component model libraries is available free of charge for six months to Genesys 2014 users new to Modelithics. 


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Analyst update in NI AWR software dramatically reduces simulation times

Software/EDA
National Instruments (NI)
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 NI (formerly AWR Corporation) has released V11.01 of the NI AWR Design Environment™ with enhancements to Analyst™ 3D finite element method (FEM) EM simulation engine that cuts simulation times by as much as 70 percent over previous versions.  


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Optenni Lab 3.0 available through CST sales channels

CST
No Comments

Computer Simulation Technology has announced the availability of Optenni Lab 3.0 through the worldwide CST sales network.


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2014 Design Software Review: Interoperability

Agilent Technologies, NI/AWR, ANSYS, COMSOL, CST, Delcross and Sonnet Software
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EVENTS

CST Workshops and Trainings

9/1/14

CST
CST Workshops and Trainings

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COMSOL Conference 2014 Cambridge

9/17/14
Churchill College
Cambridge
United Kingdom

Comsol Conf UK 2014 logo      Highlighting multiphysics modeling and simulation.

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Simulations of Gyrotrons with VSim

9/24/14

Tech-X Corporation
Technical Education Webinar Series

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COMSOL Conference 2014 Boston

10/8/14
Boston Newton Marriott
Newton, MA
United States

Comsol Conf 2014 logo      Highlighting multiphysics modeling and simulation.

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DOCUMENTS AND FILES

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

December 17, 2013
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

June 14, 2013
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

December 15, 2012
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

June 1, 2012
Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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