Computer Simulation Technology announced the winners of the CST University Publication Award 2015, an annual prize given to university institutes and researchers for published papers involving applications of electromagnetic simulation.
NI (formerly AWR Corp.) released its version 12 Analyst-MP™ 3D multiphysics finite element method (FEM) electromagnetic (EM) analysis software. This latest version delivers up to 10X improvement in speed from the previous version, making it even faster for analyzing extremely complex high-frequency, multiphysics structures.
Optenni Ltd. announces an improved link between ANSYS® HFSS and Optenni Lab™ for designing matching circuits for antennas and RF components based on 3D models simulated with HFSS. This tight integration is made possible by the new ANSYS® Electronics Desktop™ technology included with HFSS. It delivers a new paradigm for electronic design with highly productive drag and drop dynamic links between electromagnetic field extraction and circuit simulation for easy problem set-up and reliable product performance.
Teledyne LeCroy announces automated physical layer transmitter compliance test capability for the MIPI M-PHY standard. The new compliance test software, QPHY-MIPI-MPHY, enables the highest level of confidence in M-PHY compliance by measuring a large number of cycles in a short period of time.
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Engineers who test mobile power amplifiers and front end modules are looking for ways to reduce test cost through maximizing throughput while ensuring that the devices meet required performance levels. This application note discusses these complex issues and recommended solutions using the Agilent PXI M9381A Vector Signal Generator as an example.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.
Signals intelligence describes a broad range of applications ranging from communications jamming to identification of interference or pirating signals. While this paper discusses many of the
specific needs for each application, it primarily focuses on the techniques required to analyze intermittent or "bursty" RF signals.