Articles by DuPont Microcircuit Materials
November 30, 2012
DuPont Microcircuit Materials (MCM) is introducing a new series of screen printed conductive ink materials for the printed electronics market, designed to offset the rising cost of silver. Utilizing proprietary technology and under typical processing conditions used for many printed electronic applications, DuPont PE8XX series conductive inks can provide low resistivity with 20 percent or more potential cost savings for manufacturers.
October 10, 2011
DuPont Microcircuit Materials , part of DuPont Electronics & Communications, is highlighting two key technical developments at the International Microelectronics and Packaging Society’s 44 th International Symposium on Microelectronics, Oct. 9 to 13, 2011, in Long Beach, CA. The company’s newest product development, DuPont™ GreenTape™ 9K5 low temperature co-fired...
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March 9, 2009
DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, and CAD Design Software have announced the integration of DuPont™ GreenTape™ low temperature co-fired ceramic (LTCC) materials and manufacturing processes into CAD Design Software’s Electronic Design Automation (EDA) design tools for Ceramic (Hybrid/MCM – LTCC) circuit design. By incorporating the...
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Benefits of low temperature cofired ceramic materials on portable wireless applications
April 1, 2001
PRODUCT FEATURE Cost-effective Solutions for High Density Interconnect and RF Modules Using Low Temperature Cofired Ceramic Materials DuPont Microcircuit Materials Research Triangle Park, NC C urrently, the most significant driver for packaging and high density interconnects is wireless communications. Figure 1 illustrates the projected regional growth of wireless subscribers...
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A new low loss, low temperature cofired ceramic system for high frequency applications
February 1, 2001
PRODUCT FEATURES Characterization of Low Loss LTCC Materials at 40 GHz DuPont Microcircuit Materials Research Triangle Park, NC T he dramatic increase in the application of microwave technologies due to the growth in wireless communications has created many challenges for interconnect and packaging technologies. The majority of wireless equipment...
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