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ARTICLES

Chip-size Package Technology for Semiconductors

A novel chip-size ball-grid array package construction, process flow and reliability data
Chip-size Package Technology for Semiconductors Chip-scale packaging (CSP) of IC devices is rapidly gaining acceptance worldwide because of intrinsic size advantages, the promise of highly favorable cost/performance trade-offs and reliance on existing materials and assembly infrastructures. The compliant, flex-circuit-based package is increasingly being viewed as the CSP method of...
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