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AWR Corp., the innovation leader in high-frequency EDA software, is a gold sponsor and will offer a full agenda of activities at the International Microwave Symposium (IMS) 2013 that inform and educate attendees about new ways to use RF/microwave software for circuit and system design. IMS 2013 takes place from June 4 to 7 in Seattle, Washington.
AWR has posted a university success story detailing how Nanjing University of Aeronautics and Astronautics (NUAA) evaluated AWR’s Microwave Office RF and microwave design software as well as its AXIEM EM simulator for university research and education programs.
AWR Corp., the innovation leader in high-frequency EDA software, announced the start of its AWR Design Forum 2013 tour with a diverse schedule of dates and venues in the Asia Pacific region starting this summer. ADF is an open event at which designers of microwave and RF circuits and systems such as MMIC, RF PCB, and LTE can network and share useful information and resources pertinent to high-frequency design, discuss AWR products and technologies, and collaborate on industry issues and trends. Details are available at http://www.awrcorp.com/ADF2013.
AWR’s new application note titled, "Multisim/Ultiboard for Low-Frequency Simulation and Layout" details how to complement Microwave Office® circuit design software with NI’s Multisim circuit simulation software and Ultiboard printed circuit board (PCB) layout software for a comprehensive design flow.
AWR Corp., the innovation leader in high-frequency EDA software, announces that it will continue to offer its popular Graduate Gift Initiative to graduating engineering students worldwide for a record fourth consecutive year.
AWR Corp. announces the addition of two new stories to its roster of university student and professor design successes using AWR software. These new stories include contributions from Okinawa National College of Technology in Japan and Macquarie University in Australia.
AWR Corp., the innovation leader in high-frequency EDA software, announced the sponsorship of two major student design competitions in China as part of the company’s continuing focus on working with universities worldwide to empower students with RF/microwave software tool experience and jumpstart their engineering careers.
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.
AWR has just published a new Microwave Office® software application note titled, “End-to-end Design and Realization of an X-band Transmission Analyzer Using AWR Circuit, System, and EM Software.” The note examines the complete flow and details the design of several critical design elements for this device, which integrates many RF components on a single printed circuit board (PCB).
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