advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Semiconductors / Integrated Circuits

UMS leverages Agilent Technologies’ ADS software

UMShas announced the availability of greatly enhanced Process Design Kits leveraging the latest product innovations in Agilent’s ADS electronic design automation software.


Read More

BAE Systems’ smaller, faster chips benefit space exploration

International

BAE Systems’ new 45 nm ASICs for space environments pack ten times more functionality and performance into the same size as current chips, without adding significant power needs.


Read More

NXP delivers first RoadLINK automotive processor

International

NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.


Read More

Ningbo IC design students offered jobs by Sondrel in China

Twenty one students from The University of Nottingham Ningbo Campus (UNNC), UK who have just completed a unique training course in the design of integrated circuits, have all been offered jobs by Sondrel in China.


Read More

Nujira selects ASE as packaging and test partner for handset ET chip

RFIC

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.


Read More

Fujitsu begins sample shipments of 150 V breakdown GaN power device

Fujitsu Semiconductor Europe (FSEU) announced the release of MB51T008A, a silicon substrate-based, GaN power device that features a breakdown voltage of 150 V.


Read More

Isola expands manufacturing capabilities in Suzhou, China

Isola Group S.a.r.l., a market leader in laminate materials used to fabricate advanced multi-layer printed circuit boards, has expanded its Suzhou, China manufacturing facility.


Read More

Silicon Labs acquires Energy Micro

Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, has signed a definitive agreement to acquire Energy Micro AS based in Oslo, Norway, the late-stage privately held company that offers a power-efficient portfolio of 32-bit microcontrollers and is developing multi-protocol wireless RF solutions.


Read More

Element Six acquires assets and IP of Group4 Labs

Element Six has acquired the assets and intellectual property of Group4 Labs, Inc., a semiconductor wafer materials company that manufactured GaN on-diamond semiconductor technology for RF and high-power devices.


Read More

EnSilica partners with Cross Border Technologies in Europe and Asia

EnSilica has partnered with Cross Border Technologies to accelerate the sales of both its IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement