M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.
From technical sessions, panels and workshop, RF IC front-ends will be under the spotlight
February 27, 2014
Integrated circuits and semiconductor technology are critical to the overall performance of electronic systems, whether the application is for mobile communications, radar or satellite navigation. The design track reflects the industry’s focus on recent advances in design technology with an emphasis on specific components such as filters and power amplifiers. Doherty and class-F PA architectures along with techniques such as digital pre-distortion and envelop tracking that are garnering so much industry attention at the moment will be among the hot topics presented in the field of power amplifier design.
Peregrine Semiconductor Corp. has announced UltraCMOS®Global 1, claimed to be the first reconfigurable RF front end (RFFE). For the first time, 4G LTE platform providers and OEMs will be able to save time and money by creating a single-SKU design for global markets.
STMicroelectronics has announced Teseo III, a single-chip standalone positioning product family capable of receiving signals from multiple satellite navigation systems, including the Chinese BeiDou, the U.S. GPS, European Galileo, Russia’s GLONASS and Japan’s QZSS.