advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Semiconductors / Integrated Circuits

Nujira selects ASE as packaging and test partner for handset ET chip

RFIC

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.


Read More

Fujitsu begins sample shipments of 150 V breakdown GaN power device

Fujitsu Semiconductor Europe (FSEU) announced the release of MB51T008A, a silicon substrate-based, GaN power device that features a breakdown voltage of 150 V.


Read More

Isola expands manufacturing capabilities in Suzhou, China

Isola Group S.a.r.l., a market leader in laminate materials used to fabricate advanced multi-layer printed circuit boards, has expanded its Suzhou, China manufacturing facility.


Read More

Silicon Labs acquires Energy Micro

Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, has signed a definitive agreement to acquire Energy Micro AS based in Oslo, Norway, the late-stage privately held company that offers a power-efficient portfolio of 32-bit microcontrollers and is developing multi-protocol wireless RF solutions.


Read More

Element Six acquires assets and IP of Group4 Labs

Element Six has acquired the assets and intellectual property of Group4 Labs, Inc., a semiconductor wafer materials company that manufactured GaN on-diamond semiconductor technology for RF and high-power devices.


Read More

EnSilica partners with Cross Border Technologies in Europe and Asia

EnSilica has partnered with Cross Border Technologies to accelerate the sales of both its IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea.


Read More

MEI Wet Bench Automates Wafer Fab

RFIC

MEI was at CS Man Tech the week of May 13th to demo the company's high-quality semiconductor and batch immersion process tools that perform. All MEI’s semiconductor equipment are custom tailored to specific semiconductor processes and chemistry.


Read More

Cree to feature its GaN technology in RF Zone at CTIA 2013

Cree Inc. will be a first time exhibitor this year in the RF/Microwave Zone at CTIA 2013. The RF Zone, which is organized and managed by Microwave Journal, features approximately twenty RF component and communication IC manufacturers along with test equipment providers. Cree is a world’s leading manufacturer of GaN HEMT devices, which are ideally suited for a host of telecom applications in both macro-base stations and small cells. These devices are perfect for applications seeking to improve bandwidth, efficiency, frequency of operation, or for transmitters challenged to reduce size and weight.


Read More

ST and ESA perform first position fix using Galileo satellites

International

STMicroelectronics announced that its Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s Galileo navigation system.


Read More

Interlligent RF & MW Solutions to supply Lime with T&M equipment

Lime Microsystems has signed a deal with Interlligent RF & MW Solutions to use the company's latest test and measurement technology in the development of its FPRF transceiver ICs.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement