Semiconductors / Integrated Circuits

CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware

Fri, 29 May 2026 10:26:19 -0400

CEA-Leti announced a major milestone in the evolution of 3D integration for HPC, advanced smart-vision systems and AI, demonstrating a functional test vehicle utilizing D2W hybrid bonding with pitches down to 1 μm. The findings were presented at the ECTC 2026.

Imec Presents Quantum Dot Qubit Device Using High NA EUV Lithography

Tue, 26 May 2026 16:35:25 -0400

This week, at ITF World, imec, presents a world first: a quantum dot qubit device fabricated using High NA EUV lithography.

CEA‑Leti to Showcase Integrated Expertise in Microelectronics Reliability at IRPS 2026

Tue, 17 Mar 2026 10:24:48 -0400

At IRPS 2026, CEA‑Leti will present seven papers that reflect a broad and integrated expertise across device physics, process integration, RF technologies, FD‑SOI, GaN, BEOL reliability and low‑temperature platforms enabling 3D sequential integration.

Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates

Mon, 02 Mar 2026 12:00:10 -0500

Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17, iPhone 17 Pro and iPhone 17 Pro Max relies on fully depleted silicon-on-insulator (FD-SOI) substrate technology.

Compound Semiconductors Enter a New Growth Phrase Powered by AI & Electrification

Mon, 23 Feb 2026 08:58:52 -0500

Yole Group announced the release of its annual market and technology report, "Status of the Compound Semiconductor Industry 2026 – Focus on Substrates and Epiwafers," highlighting sustained structural growth through 2031.

YINCAE Drives Semiconductor Innovation at APEX 2026 — Booth #4130

Wed, 18 Feb 2026 11:36:38 -0500

YINCAE Advanced Materials Co., Ltd. will exhibit at APEX 2026, March 17–19, at the Anaheim Convention Center in Anaheim, Calif.

RTX’s Raytheon to Accelerate Domestic Supply of Critical Material for Commercial and Defense Applications

Tue, 17 Feb 2026 10:53:56 -0500

Raytheon was awarded a contract from the Air Force Research Laboratory to develop a domestic production capability for thin film lithium niobate (TFLN) wafers, a material essential to high speed, secure communications and advanced sensing systems.

RF GaN: Geopolitics Fuel Sustained Growth

Thu, 05 Feb 2026 09:54:05 -0500

According to Yole Group’s latest report on the RF GaN market, GaN devices play a critical role in high-power RF signal generation and amplification, with growing adoption across telecom infrastructure, defense and satellite communications.

Texas Instruments to Acquire Silicon Labs

Wed, 04 Feb 2026 14:04:16 -0500

Texas Instruments and Silicon Labs announced they have signed a definitive agreement under which Texas Instruments will acquire Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.

Siemens Acquires Canopus AI

Wed, 04 Feb 2026 09:43:05 -0500

Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.

Northrop Grumman Awarded Contracting Tool to Accelerate American-Made Microelectronics into Military Systems

Mon, 02 Feb 2026 10:35:54 -0500

Northrop Grumman is one of the companies selected to receive an award from the Defense Microelectronics Activity (DMEA) for a contracting resource.

ICsense Increases In-House ASIC Volume Production Capability with Opening of New Electrical Wafer Sort Cleanroom

Mon, 26 Jan 2026 08:02:48 -0500

ICsense has opened a new electronic wafer sort (EWS) cleanroom as part of its latest strategic investment program.

NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production

Tue, 16 Dec 2025 15:18:56 -0500

NHanced Semiconductors announced their new Besi bonding system, further expanding its advanced packaging yield and throughput.

Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Thu, 11 Dec 2025 11:32:25 -0500

Indium Corporation announced the global availability of SiPaste^® C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing.

CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic

Wed, 10 Dec 2025 11:50:56 -0500

CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing key enablers for a new high performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF and Optical FEM.

UMS Unveils New GH10-10, 0.1 µm GaN Technology

Fri, 05 Dec 2025 14:34:04 -0500

United Monolithic Semiconductors (UMS) announced that its new GH10-10 GaN technology is now fully qualified and already opened in production mode, empowering our customers with high performance, fast time-to-market and greater competitive advantages.

Glass Materials for Semiconductor Manufacturing: A Strategic Platform Reshaping the Future of Devices, Process and Supply Chains

Wed, 26 Nov 2025 08:16:00 -0500

Yole Group announced the release of its new technology and market report, Glass Materials for Semiconductor Manufacturing 2025, a comprehensive study analyzing the rapid rise of glass as a strategic material in semiconductor processes and permanent device architectures.

Semiconductor Industry 2025: Worldwide Dynamics and China’s Strategic Rise Unveiled

Fri, 14 Nov 2025 07:58:40 -0500

Yole Group announced the release of two complementary reports: Overview of the Semiconductor Devices Industry – H2 2025, providing a global assessment of the semiconductor devices market, and China Semiconductor Industry 2025, offering an in-depth analysis of China’s emerging semiconductor supply chain from equipment to devices, including foundries and OSATs.

MACOM to Manufacture HRL’s 40 nm GaN-on-SiC Process

Tue, 04 Nov 2025 09:47:49 -0500

MACOM Technology Solutions Inc. announced that it has entered into an agreement with HRL Laboratories to license and manufacture HRL’s proprietary 40 nm T3L GaN-on-SiC process technology.

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces Call for Papers

Wed, 15 Oct 2025 10:08:44 -0400

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits has announced a call for papers deadline of January 26, 2026 with the theme: “Advancing the AI Frontier through VLSI Innovation.”

2025 IEEE IEDM to Showcase Latest Technologies in Microelectronics Under the Theme “100 Years of FETs: Shaping the Future of Device Innovations”

Wed, 08 Oct 2025 16:21:18 -0400

Supporting the theme “100 Years of FETs: Shaping the Future of Device Innovations,” the 2025 IEDM technical program will consist of 295 presentations, plus a host of events that include Focus Sessions, Tutorials, Short Courses, an evening panel, a career luncheon, supplier exhibit and IEEE/EDS award presentations.

Northrop Grumman Opens Access to U.S. Semiconductor Facilities

Thu, 18 Sep 2025 13:10:16 -0400

Northrop Grumman’s Microelectronics Center is now open for external aerospace and defense companies to access the company’s three U.S. government-accredited semiconductor manufacturing facilities.

RapidRF - New Capabilities with UMS & WIN GaAs Technologies

Tue, 16 Sep 2025 09:19:54 -0400

RapidRF is expanding its technology portfolio with new GaAs Technologies from UMS and WIN now available on the RapidRF design platform.

GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High Performance Smart Mobile, Communication and Industrial Applications

Thu, 28 Aug 2025 10:55:01 -0400

GlobalFoundries announced the production release of its 130 nm complementary Bi-CMOS platform, the company’s highest performance SiGe technology to date.

GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications

Thu, 28 Aug 2025 10:48:56 -0400

At its annual Technology Summit in California, GlobalFoundries (GF) announced the availability of its 22FDX+ with Resistive RAM (RRAM) technology, marking a significant advancement in the company’s portfolio of eNVM solutions.

GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity

Thu, 28 Aug 2025 10:35:52 -0400

At its annual Technology Summit in California, GlobalFoundries (GF) announced a milestone for its 40 nm process technology through its partnership with Silicon Labs.

The Netherlands and Belgium: Crossroads of the European Microwave Industry

Mon, 11 Aug 2025 00:00:00 -0400

How Sputtering Could Drive the Adoption of High Performance ScAlN-Based Transistors

Fri, 08 Aug 2025 08:08:26 -0400

Tokyo University of Science researchers unveil the critical role of growth temperature in sputter epitaxy of scandium aluminum nitride (ScAlN) films on GaN heterostructures.

Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices

Thu, 31 Jul 2025 09:45:22 -0400

Indium Corporation announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.

Semiconductor Foundry Landscape to Transform by 2030

Tue, 24 Jun 2025 12:24:53 -0400

Yole Group unveils its latest Status of the Semiconductor Foundry Industry report, offering a comprehensive view into a sector undergoing profound transformation.