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Semiconductors / Integrated Circuits

Fujitsu, Panasonic DBJ sign MoU to establish new semiconductor company

Fujitsu Limited, Panasonic Corporation, and DBJ have signed a MoU in which DBJ will make an investment and provide a line of credit for a new fabless company specializing in LSI design and development, which Fujitsu and Panasonic will jointly establish.


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Indium Corporation technology experts to present at IMAPS New England

Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.


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RFMW announces TriQuint's 30 W GaN Transistors to 3.5 GHz

RFMW Ltd. announces design and sales support forwideband, DC-3.5GHz GaN transistors from TriQuint. Available as the T2G4003532-FS earless package or the T2G4003532-FL, both transistors are input prematched for S-band operation. The devices are constructed with TriQuint's proven TQGaN25 process, which features advanced field plate techniques to optimize power and efficiency at high drain bias operating conditions.


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Nujira raises $20 million in new funding

Nujira Ltd. has closed a new funding round, raising $20 million for working capital to support the production ramp of its Coolteq chips, and to fund continued development of the company’s long term product roadmap.


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NXP strengthens China team

NXP Semiconductors has appointed Li Zheng as Senior Vice President Sales & Marketing, Greater China and Country Manager for China, who will be based in Shanghai.


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Peregrine appoints Link Microtek as UK and Ireland representative

Link Microtek has been appointed as a UK and Ireland representative for Peregrine Semiconductor Corp. founder of RF SOI and pioneer of advanced RF solutions.


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Cree selects Plextek RF Integration as preferred European design resource

Plextek RF Integrationhas been selected by Cree as a preferred design resource to provide third party design services to Cree’s European foundry customers.


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MACOM to showcase highly integrated, plastic-packaged GaN solutions at EDI CON

M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.


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RF Semiconductor Technology Drives the EDI CON 2014 Technical Program

From technical sessions, panels and workshop, RF IC front-ends will be under the spotlight

Integrated circuits and semiconductor technology are critical to the overall performance of electronic systems, whether the application is for mobile communications, radar or satellite navigation. The design track reflects the industry’s focus on recent advances in design technology with an emphasis on specific components such as filters and power amplifiers. Doherty and class-F PA architectures along with techniques such as digital pre-distortion and envelop tracking that are garnering so much industry attention at the moment will be among the hot topics presented in the field of power amplifier design.


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Peregrine Semiconductor introduces first reconfigurable RF front-end system

Peregrine Semiconductor Corp. has announced UltraCMOS®Global 1, claimed to be the first reconfigurable RF front end (RFFE). For the first time, 4G LTE platform providers and OEMs will be able to save time and money by creating a single-SKU design for global markets.


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