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Semiconductors / Integrated Circuits

RF Semiconductor Technology Drives the EDI CON 2014 Technical Program

From technical sessions, panels and workshop, RF IC front-ends will be under the spotlight
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Integrated circuits and semiconductor technology are critical to the overall performance of electronic systems, whether the application is for mobile communications, radar or satellite navigation. The design track reflects the industry’s focus on recent advances in design technology with an emphasis on specific components such as filters and power amplifiers. Doherty and class-F PA architectures along with techniques such as digital pre-distortion and envelop tracking that are garnering so much industry attention at the moment will be among the hot topics presented in the field of power amplifier design.


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Peregrine Semiconductor introduces first reconfigurable RF front-end system

Peregrine Semiconductor Corp.
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Peregrine Semiconductor Corp. has announced UltraCMOS®Global 1, claimed to be the first reconfigurable RF front end (RFFE). For the first time, 4G LTE platform providers and OEMs will be able to save time and money by creating a single-SKU design for global markets.


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STMicroelectronics satellite-location chip support China’s BeiDou system

STMicroelectronics
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STMicroelectronics has announced Teseo III, a single-chip standalone positioning product family capable of receiving signals from multiple satellite navigation systems, including the Chinese BeiDou, the U.S. GPS, European Galileo, Russia’s GLONASS and Japan’s QZSS.


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NXP and Datang Telecom establish Chinese automotive semiconductor company

Datang Telecom Technology and NXP Semiconductors
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NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.


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UMS leverages Agilent Technologies’ ADS software

Agilent Technologies and United Monolithic Semiconductors
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UMShas announced the availability of greatly enhanced Process Design Kits leveraging the latest product innovations in Agilent’s ADS electronic design automation software.


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BAE Systems’ smaller, faster chips benefit space exploration

International
BAE Systems
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BAE Systems’ new 45 nm ASICs for space environments pack ten times more functionality and performance into the same size as current chips, without adding significant power needs.


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NXP delivers first RoadLINK automotive processor

International
NXP Semiconductors N.V.
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NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.


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Ningbo IC design students offered jobs by Sondrel in China

Sondrel
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Twenty one students from The University of Nottingham Ningbo Campus (UNNC), UK who have just completed a unique training course in the design of integrated circuits, have all been offered jobs by Sondrel in China.


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Nujira selects ASE as packaging and test partner for handset ET chip

RFIC
Nujira
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Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.


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Fujitsu begins sample shipments of 150 V breakdown GaN power device

Fujitsu Semiconductor Europe
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Fujitsu Semiconductor Europe (FSEU) announced the release of MB51T008A, a silicon substrate-based, GaN power device that features a breakdown voltage of 150 V.


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