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Semiconductors / Integrated Circuits

EnSilica partners with Cross Border Technologies in Europe and Asia

May 23, 2013

EnSilica has partnered with Cross Border Technologies to accelerate the sales of both its IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea.


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MEI Wet Bench Automates Wafer Fab

RFIC
May 15, 2013

MEI was at CS Man Tech the week of May 13th to demo the company's high-quality semiconductor and batch immersion process tools that perform. All MEI’s semiconductor equipment are custom tailored to specific semiconductor processes and chemistry.


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Cree to feature its GaN technology in RF Zone at CTIA 2013

May 8, 2013

Cree Inc. will be a first time exhibitor this year in the RF/Microwave Zone at CTIA 2013. The RF Zone, which is organized and managed by Microwave Journal, features approximately twenty RF component and communication IC manufacturers along with test equipment providers. Cree is a world’s leading manufacturer of GaN HEMT devices, which are ideally suited for a host of telecom applications in both macro-base stations and small cells. These devices are perfect for applications seeking to improve bandwidth, efficiency, frequency of operation, or for transmitters challenged to reduce size and weight.


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ST and ESA perform first position fix using Galileo satellites

International
April 22, 2013

STMicroelectronics announced that its Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s Galileo navigation system.


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Interlligent RF & MW Solutions to supply Lime with T&M equipment

April 5, 2013

Lime Microsystems has signed a deal with Interlligent RF & MW Solutions to use the company's latest test and measurement technology in the development of its FPRF transceiver ICs.


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Renesas Electronics announces R-Car H2 for automotive market

March 28, 2013

Renesas Electronics and Renesas Mobile Corp. have announced the availability of a new member of the R-Car Series of automotive Systems-on-Chip (SoCs).


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e2v aerospace and defense provides life extension program for Micron products

March 28, 2013

e2v aerospace and defense Inc.(e2v a&d announces a life extension program for selected Micron Technology Inc. memory devices.


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Renesas Electronics Europe expands sales in Russia and CIS

March 25, 2013

Renesas Electronics Europe, supplier of advanced semiconductor solutions, has launched an expanded drive to build sales in Russia and other CIS countries.


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Tensilica and Huawei expand strategic relationship

March 8, 2013

Tensilica® Inc. has strengthened its strategic relationship with Huawei with the announcement that HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s Dataplane Processor Units.


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STMicroelectronics reaches three billion MEMS sensor milestone

February 4, 2013

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced it has shipped three billion MEMS sensors to date.


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