advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Semiconductors / Integrated Circuits

STMicroelectronics satellite-location chip support China’s BeiDou system

January 13, 2014

STMicroelectronics has announced Teseo III, a single-chip standalone positioning product family capable of receiving signals from multiple satellite navigation systems, including the Chinese BeiDou, the U.S. GPS, European Galileo, Russia’s GLONASS and Japan’s QZSS.


Read More

NXP and Datang Telecom establish Chinese automotive semiconductor company

December 9, 2013

NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.


Read More

UMS leverages Agilent Technologies’ ADS software

October 21, 2013

UMShas announced the availability of greatly enhanced Process Design Kits leveraging the latest product innovations in Agilent’s ADS electronic design automation software.


Read More

BAE Systems’ smaller, faster chips benefit space exploration

International
October 21, 2013

BAE Systems’ new 45 nm ASICs for space environments pack ten times more functionality and performance into the same size as current chips, without adding significant power needs.


Read More

NXP delivers first RoadLINK automotive processor

International
October 15, 2013

NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.


Read More

Ningbo IC design students offered jobs by Sondrel in China

September 16, 2013

Twenty one students from The University of Nottingham Ningbo Campus (UNNC), UK who have just completed a unique training course in the design of integrated circuits, have all been offered jobs by Sondrel in China.


Read More

Nujira selects ASE as packaging and test partner for handset ET chip

RFIC
September 9, 2013

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.


Read More

Fujitsu begins sample shipments of 150 V breakdown GaN power device

July 29, 2013

Fujitsu Semiconductor Europe (FSEU) announced the release of MB51T008A, a silicon substrate-based, GaN power device that features a breakdown voltage of 150 V.


Read More

Isola expands manufacturing capabilities in Suzhou, China

July 22, 2013

Isola Group S.a.r.l., a market leader in laminate materials used to fabricate advanced multi-layer printed circuit boards, has expanded its Suzhou, China manufacturing facility.


Read More

Silicon Labs acquires Energy Micro

June 10, 2013

Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, has signed a definitive agreement to acquire Energy Micro AS based in Oslo, Norway, the late-stage privately held company that offers a power-efficient portfolio of 32-bit microcontrollers and is developing multi-protocol wireless RF solutions.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement