Semiconductors / Integrated Circuits

Subscribe

Infineon Technologies has introduced its first power switching devices designed specifically for use in space and avionics applications. The new Radiation Hardened (RH) PowerMOS devices of the BUY25CSXX family are claimed to offer best-in-class performance to support design of energy-efficient power conditioning and power supply systems for space use.

Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.

The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.

Nordic Semiconductor announced the release of its µBlue™ nRF8002 System-on-Chip (SoC) that provides a low cost, ultra-low power, easy to design-in single chip solution for Bluetooth Smart wireless tags and accessories.

ip.access confirmed plans to build its first integrated LTE and 3G small cell. The new unit, codenamed the E-100, will be the first from the company to be based on the QorIQ Qonverge^®platform from US chip maker Freescale.

Infineon Technologies and Fairchild Semiconductor have extended their compatibility partnership to encompass Infineon’s proprietary 5 x 6 power stage asymmetric dual MOSFET package. The PowerStage 5 x 6 is a leadless SMD package, which integrates the low-side and high-side MOSFET of a synchronous DC/DC converter into a 5 by 6 mm² package outline.

United Monolithic Semiconductors (UMS) has announced that the PPH15X-10 MMIC GaAs power PHEMT process has been successfully space evaluated and is now part of the European Preferred Part List established by the European Space Agency/European Space Components Information Exchange System (ESA/ESCIES).

2011 marked a big year for mergers and acquisitions (M&A) in the mobile device semiconductor market. From Intel's acquisition of Infineon Technologies AG Wireless Solutions to NVIDIA's purchase of Icera, the mobile device semiconductor market has seen a lot of moving and shaking.