Semiconductors / Integrated Circuits - Articles - Page 163

RFMD Completes Acquisition of Filtronic Compound Semiconductors Ltd.

March 4, 2008

RF Micro Devices announced the completion of its acquisition of Filtronic Compound Semiconductors Ltd., a wholly owned subsidiary of Filtronic PLC. Under the terms of the transaction, RFMD paid an acquisition price of approximately £12.5 M in cash for Filtronic Compound Semiconductors. The acquisition price included the purchase of...

Agilent and Beceem Collaborate on Mobile WiMAX Protocol Test Solution

March 4, 2008

Microwave Journal

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Agilent Technologies Inc. and Beceem Communications announced they will extend their WiMAX collaboration to include Mobile WiMAX Wave 2 Protocol Test. Agilent and Beceem will ensure that customers can confidently use Agilent protocol test systems with Beceem's Mobile WiMAX reference designs. Both companies will verify that their designs are...

RFMD® Completes Acquisition of Filtronic Compound Semiconductors Ltd

March 3, 2008

Dean Priddy, CFO

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RF Micro Devices (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency systems and solutions, today announced the completion of its acquisition of Filtronic Compound Semiconductors Ltd, a wholly owned subsidiary of Filtronic PLC (LSE:FTC).

RFMD® Completes Acquisition of Filtronic Compound Semiconductors Ltd

March 3, 2008

0 Comments

RF Micro Devices (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency systems and solutions, today announced the completion of its acquisition of Filtronic Compound Semiconductors Ltd, a wholly owned subsidiary of Filtronic PLC (LSE:FTC).

March 2008 Off-The-Shelf Newsletter

March 1, 2008

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Featuring 25 new products with full descriptions, features and applications on each product.

Park Opens Pioneering Composite Materials Facility in Singapore

February 27, 2008

Microwave Journal

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Park Electrochemical Corp., a global advanced materials company that develops and manufactures high-technology digital and RF/microwave printed circuit materials and advanced composite materials, has opened a new advanced composite materials ‘Pioneer Plant’ located on Pioneer Road in Jurong, Singapore. The company’s manufacturing facilities are located in Singapore, China, France,...

Process Engineer Advocates Clean Surface-mount Technology

February 27, 2008

Microwave Journal

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Clean technologies represent a huge component of the future of Silicon Valley. Investment in the sector is growing dramatically from an estimated $917 M in VC funding in 2005 to a projected $19 B by the year 2010. Solar and LED technologies stand to be the areas with the...

Rohde & Schwarz Joins LSTI

February 20, 2008

Microwave Journal

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Rohde & Schwarz has joined the LTE/SAE Trial Initiative (LSTI), through which leading telecommunications providers and network operators have banded together to promote the further development of broadband mobile radio networks that are based on UMTS Long Term Evolution (LTE) technology. By becoming a member, the company will contribute...

New Interconnect Technology Addresses System Integration

February 15, 2008

David Vye

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David Sherrer, Director of Research and Product Development at Rohm and Haas Electronics Materials, spoke with Microwave Journal about Rohm and Haas’ new PolyStrata™ micro-fabrication technology. This new process produces perfectly shielded, low-loss, broadband transmission line networks, which enable low-cost, miniaturized and highly integrated component and systems for complex microwave and millimeter-wave applications.

Executive Interview: David Sherrer, Rohm and Haas Electronics Materials

February 15, 2008

David Vye

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Executive
Interviews
February 2008

David Sherrer, Director of Research and Product Development at Rohm and Haas Electronics Materials, spoke with Microwave Journal about Rohm and Haas’ new PolyStrata™ micro-fabrication technology. This new process produces perfectly shielded, low-loss, broadband transmission line networks, which enable low-cost, miniaturized and highly integrated component and systems for complex microwave and millimeter-wave applications.

Interview with David Sherrer

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