Materials/Packages

CTIA Wireless 2009 – Going Green

The International CTIA WIRELESS 2009 event is where broadband communications come to life as the event was branded as “Mobile Life”. It embodied this name as new technologies rolled out to make broadband more widely adopted and seamless but another overriding theme was “Green Technology” especially when your featured...
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Rogers Introduces RO4000 LoPro Laminates

Rogers Advanced Circuit Materials (ACM) Division announced its new reverse-treated copper foil option on RO4000® series laminates. The RO4000 LoPro™ laminates are enabled by special interface technology to be made with very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000...
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IMS 2009 to Offer Robust Technical Program

The program for this year’s International Microwave Symposium (IMS), the annual conference and exhibition of the IEEE Microwave Theory and Techniques Society (MTT-S), is now available. The IMS 2009 conference will feature 430 technical presentations, organized in four technical tracks: Microwave Modeling; Active Components; Passive Components; and Microwave Systems....
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Advances in High-Performance Ceramic Antennas for Small-Form-Factor, Multi-Technology Devices

Two trends are well underway in portable and handheld consumer electronic devices: shrinking form factors and the integration of multiple wireless technologies, such as Bluetooth™, cellular, GPS and Wi-Fi. These trends create challenges for device vendors and integrators by increasing the likelihood of RF noise and other system interactions that can undermine antenna performance.
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Rogers to Showcase High Frequency Laminates

Rogers Corp. , a supplier of high frequency laminates for circuit boards in amplifiers, microwave radios, base station antennas, routers and switches, will feature a variety of its high performance materials at CTIA 2009, in Las Vegas, NV, April 1st through 3rd (Booth# 1074). Rogers Corp., participating for the...
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Agilent Technologies to Collaborate with ASTER

Agilent Technologies Inc. announced a strategic partnership with ASTER Technologies to enable integration of ASTER's TestWay Coverage Analyst with Agilent's printed circuit board assembly test platforms, enabling seamless test coverage analysis across test platforms. The TestWay Coverage Analyst provides a push-button test coverage analysis tool for coverage estimation (pre-test...
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