RF & Microwave Industry News

RSS

ST-Ericsson announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity GNSS business to a leading semiconductor company.

Mesuro has launched a new test solution that utilizes an ‘envelope load pull technique’, along with the latest generation of commercial off-the-shelf PXI hardware and LabVIEW system design software from National Instruments.

Element Six has acquired the assets and intellectual property of Group4 Labs, Inc., a semiconductor wafer materials company that manufactured GaN on-diamond semiconductor technology for RF and high-power devices.

Rohde & Schwarzand 7Layers have verified and validated the Synchronized test approach to determine the Envelope Correlation Coefficient, which characterizes the antenna subsystem of MIMO LTE devices.

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”. 

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming International Microwave Symposium (IMS) 2013 to be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, and the ARFTG Microwave Measurement Conference. The exhibition takes place June 4-7, 2013 at the Washington State Convention Center located at 800 Convention Place in Seattle.

CEA-Leti announced it is coordinating the multi-partner CORMORAN project focusing on new forms of cooperation in and between wireless body area networks. Targeted applications include coordinated navigation of groups in buildings or large-scale motion capture for gaming, sports and healthcare.

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, released its new gallium nitride (GaN) integrated power doubler with superior performance for fast-growing CATV infrastructure.

Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).

Dover announced that its Board of Directors has unanimously approved a plan to spin off certain of its communication technologies businesses into a standalone, publicly traded company.