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ARTICLES

CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

December 9, 2013

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.


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CORMORAN project exploring ways to improve cooperation in and between WBANs

May 30, 2013

CEA-Leti announced it is coordinating the multi-partner CORMORAN project focusing on new forms of cooperation in and between wireless body area networks. Targeted applications include coordinated navigation of groups in buildings or large-scale motion capture for gaming, sports and healthcare.


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BeSpoon and Leti establish world record distance measurement on a single chip

April 22, 2013

BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880 m (standard regulation) and 3,641 m (emergency situations).


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CEA-Leti obtains test licence to validate wireless technologies in TVWS

January 22, 2013

CEA-Leti, which has developed opportunistic radio technologies (or cognitive radio) since 2005, is the first research center in France to be granted a government licence to experiment with television white space equipment in the field.


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Leti and Agilent to present results on MM-wave short-range communication integrated systems IEEE SiRF

January 18, 2013

CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, TX, Jan. 21-23.


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