Articles Tagged with ''beijing''

RFHIC joins EDI CON 2014 as a Gold sponsor

Leading GaN-based RF power amplifier manufacturer will share its expertise in wideband, high performance devices with Chinese designers and wireless infrastructure system integrators

Horizon House Publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China.


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Richardson RFPD at EDI CON 2013

Richardson RFPD Inc. announces its attendance and participation at EDI CON 2013. EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets.


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AWR to sponsor and exhibit at EDI CON 2013

What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.


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Rogers appoints new president of Asia region

Rogers Corp. announced the appointment of Helen Zhang as President of Asia Region to oversee the company’s growing business in Greater China and throughout the Asia-Pacific region. Zhang will be responsible for driving Rogers’ growth strategy in Asia across the company’s three core businesses of printed circuit materials, power electronics solutions and high performance foams. 


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