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ARTICLES

EDI CON USA Announces 2017 Event: Save the Date!

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 


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EDI CON USA 2016 Video Demonstrations

Take a look at the new product and application demonstrations from EDI CON USA 2016 that took place in Boston last month. New applications such as automotive radar, mmWave measurements, signal integrity and EMI are covered, featuring companies such as Keysight, R&S, NI and CST.


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High Frequency and High Speed Design Engineers Unite in Boston

EDI CON USA Complete Show Review

The inaugural EDI CON USA conference and exhibition took place on September 20-22, 2016 at the Hynes Convention Center in Boston, Mass.  Nearly 1500 attendees took advantage of the opportunity to meet one-on-one with more than 140 exhibitors from the RF, microwave and high-speed digital industries. Here is a complete review of the event.


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EDI CON USA announces expert panel sessions on 5G and connected cars

EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its interactive expert panel sessions covering 5G mmWave Applications and Connected Cars, moderated by Microwave Journal editors.


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James Komiak from BAE Systems to Keynote Amplifier Track at EDI CON USA

EDI CON USA 2016 is pleased to announce that James Komiak, Ph.D., renowned amplifier expert and Global Engineering/Scientific Fellow at BAE Systems, will be kicking off the conference’s amplifier track on Tuesday September 20 at 9:30 a.m. with a keynote talk. Taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, the EDI CON USA conference and exhibition brings together engineers working on high-frequency analog and high-speed digital designs for learning and networking opportunities.  


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EDI CON China 2017 opens Call For Papers

EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-27, 2017 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the Call for Papers is open. 


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EDI CON USA announces Test & Measurement Content

EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its Measurement Track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone.


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EDI CON China 2016 adds RF Silicon on Insulator track and keynote

EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC), is pleased to announce that GLOBALFOUNDRIES’ Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing, will kick off the newly added RF Silicon on Insulator (SOI) Technology Track with a keynote talk entitled, “RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow.” 


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Dr. Song Junde to give keynote speech at EDI CON 2014 as conference chairman emeritus

EDI CON 2014 has announced that Dr. Song Junde, professor at the Beijing University of Posts and Telecommunications, will serve as the chairman emeritus of the second annual technical conference and trade exposition focused on RF, microwave and high-speed digital design. Junde, who held the role of honorary chair for the inaugural EDI CON in March of 2013, will once again provide guidance to the event organizers and technical program planning committee in the development of a technical conference focused on advancing microwave technology and the communications industry in China. 


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