ARTICLES

EDI CON China 2017 Announces Keynote and Panels

EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-27 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the keynote speaker for this year’s event will be Peter Rabbeni, Sr. Director RF BU Product Marketing at GLOBALFOUNDRIES. Rabbeni will bring his significant insights on semiconductor technology to bear on his talk entitled, “Technologies for the Next Wave of Mobile Data.”


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EDI CON USA 2017 Opens Call for Abstracts

RF/Microwave and High-Speed Digital Topics Welcome

EDI CON USA 2017 announces that this year’s call for abstracts (CFA) is now open. The EDI CON USA Technical Advisory Committee, event management team, and this year’s conference chairs, Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. and Istvan Novak, Senior Principal Engineer at Oracle, worked in conjunction to develop the CFA. 

 


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EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team announced this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


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EDI CON USA Announces 2017 Event: Save the Date!

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 


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EDI CON USA 2016 Video Demonstrations

Take a look at the new product and application demonstrations from EDI CON USA 2016 that took place in Boston last month. New applications such as automotive radar, mmWave measurements, signal integrity and EMI are covered, featuring companies such as Keysight, R&S, NI and CST.


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High Frequency and High Speed Design Engineers Unite in Boston

EDI CON USA Complete Show Review

The inaugural EDI CON USA conference and exhibition took place on September 20-22, 2016 at the Hynes Convention Center in Boston, Mass.  Nearly 1500 attendees took advantage of the opportunity to meet one-on-one with more than 140 exhibitors from the RF, microwave and high-speed digital industries. Here is a complete review of the event.


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James Komiak from BAE Systems to Keynote Amplifier Track at EDI CON USA

EDI CON USA 2016 is pleased to announce that James Komiak, Ph.D., renowned amplifier expert and Global Engineering/Scientific Fellow at BAE Systems, will be kicking off the conference’s amplifier track on Tuesday September 20 at 9:30 a.m. with a keynote talk. Taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, the EDI CON USA conference and exhibition brings together engineers working on high-frequency analog and high-speed digital designs for learning and networking opportunities.  


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EDI CON China 2017 opens Call For Papers

EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-27, 2017 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the Call for Papers is open. 


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