advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''cmos''

NXP to use Agilent electronic test products at Consumer Electronics Show

January 11, 2012

Agilent Technologies Inc. announced that its electronic test equipment will be used by NXP Semiconductors N.V. in a demonstration of its beam-forming technology for the next generation of communication and radar products at the International Consumer Electronics Show in Las Vegas, Jan. 10-13.


Read More

Samsung selects Javelin's CMOS 3G power amplifier

MMICs & More
January 31, 2012

Javelin_CMOS_PAJavelin Semiconductor Inc., innovator of the world’s first high-performance CMOS 3G power amplifier (PA), announced that Samsung Electronics Co. Ltd. has selected Javelin’s JAV5501 Band I PA for new Galaxy smartphones.


Read More

Samsung selects Amalfi's CMOS PA transmit module for handset platforms

May 14, 2012

Amalfi® Semiconductor Inc., an emerging leader in cost effective, high performance power amplifier solutions for cellular handsets, today announced that its AM7808 CMOS high-power, highefficiency transmit module has been selected by Samsung Electronics Co. Ltd. for multiple high-volume 2G handset platforms targeting emerging markets.


Read More

M/A-COM Technology Solutions introduces 6-bit serial/parallel module driver

MMICs&More
June 1, 2012

M/A COMM/A-COM Tech announced a new Transmit/Receive module Driver IC that provides 6-Bit serial/parallel logic control and T/R switch control for multifunction T/R modules. 


Read More

Peregrine Semiconductor unveils low insertion loss SP3T RF switch

June 20, 2012

Peregrine Semiconductor Corp. (Peregrine) announced from booth # 2009 at the International Microwave Symposium (IMS2012) in Montreal, the SP3T PE42430 RF switch. Developed on Peregrine’s patented UltraCMOS® technology, the PE42430 switch combines low insertion loss with high linearity, high isolation, and small package size, making it well suited for WLAN and Bluetooth® applications in the 2.4 GHz band, as well as general broadband switching applications.


Read More

Javelin Semiconductor shipping in Samsung Galaxy Appeal

MMICs&More
June 27, 2012

Javelin in the Galaxy AppealJavelin Semiconductor Inc., innovator of the world’s first high-performance CMOS 3G PA, announced that Samsung Electronics Co. Ltd. is shipping Javelin’s PA in the new Galaxy Appeal for AT&T.


Read More

M/A-COM Tech announces new high voltage CMOS driver for PIN diodes

MMICs&More
August 14, 2012

Boeing satelliteM/A-COM Technology Solutions Inc. introduced a new high voltage CMOS driver for PIN diodes for use in military and commercial radio applications. The MADR-010574 is designed to work with M/A-COM Tech’s high power and high voltage PIN diodes.


Read More

Richardson RFPD introduces low insertion loss SP3T RF switch from Peregrine Semiconductor

August 16, 2012

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new RF switch from Peregrine Semiconductor Corp. The PE42430 switch was developed on Peregrine's patented UltraCMOS® technology and combines low insertion loss with high linearity, high isolation, and small package size, making it well suited for WLAN and Bluetooth® applications in the 2.4 GHz band, as well as general broadband switching applications.


Read More

Javelin Semiconductor supplies PA to Samsung for Galaxy S Duos

September 18, 2012

Javelin Semiconductor Inc., innovator of the world’s first high-performance CMOS 3G power amplifier (PA), announced that Samsung Electronics Co. Ltd., has selected Javelin’s PA for the new Galaxy S Duos with dual SIM functionality. The Galaxy S Duos is a stylish Android-based smartphone that features a 4-inch touchscreen, 1 GHz processor, 5 megapixel camera, Bluetooth, GPS and Wi-Fi.


Read More

Tahoe RF licenses latest GNSS technology from Stanford University

September 19, 2012

Tahoe RF Semiconductor announces that it has licensed the latest GNSS (Global Navigation Satellite System) technology from Stanford University for the development of their next generation low-power, low-cost universal GNSS IC. The technology employs unique RF subsampling techniques that enable the receiver to support all the GNSS bands and be implemented on a single RF CMOS IC Technology


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up