- Buyers Guide
The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.
Mobile device semiconductors were one of the few bright spots in a chipset market that stalled in 2011. Revenue from chipsets designed for mobile devices increased by more than 20 percent to $35 billion, while the total semiconductor market limped out of 2011 with just 2 percent year-on-year growth.
Mobile handset semiconductors, including processors, RF, power management, and wireless connectivity, grew to more than $30 billion in 2011. The worldwide market generated more than $120 billion in revenue over the last five years and will generate more than $170 billion during the next five years.
Richardson RFPD Inc. announced the immediate availability of its 2012 Supplier Line Card. The updated, expanded Line Card features a section of 'Suppliers by Product Category' matrix tables that offers at-a-glance reference of supplier devices in the following categories:
Identive Group Inc. and NXP Semiconductors N.V. are providing innovative near field communication (NFC) payment tags to Yeldi Softcom Pvt Ltd to support the launch of its ‘ara eTap’ cashless payment application in India.
NXP Semiconductors and Audi have signed a strategic partnership for innovation that focuses on innovation speed and time to market in eight selected automotive electronics application segments.
imec presents the world-first ultra-high frequency Schottky diode based on amorphous Indium-Gallium-Zinc Oxide (IGZO) as semiconductor.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced it has shipped three billion MEMS sensors to date.
ON Semiconductor has introduced a new family of tunable RF components (TRFC) that address the design challenges faced by engineers developing the latest generation smartphones. The new devices optimally combine tuning range, RF quality factor (Q) and frequency operation, providing a superior solution to existing fixed approaches.
Tensilica® Inc. has strengthened its strategic relationship with Huawei with the announcement that HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s Dataplane Processor Units.
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