Articles Tagged with ''chip''

Molex, a leading global manufacturer of electronic solutions, announced the acquisition of Interconnect Systems Inc. which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.

Barry Industries introduces an ultra-broadband, DC to 60 GHz chip termination for microwave applications. The uniquely designed TV0404FA-50R0JN-91 has been third-party tested to show a typical return loss of 18.5 dB or better over a DC to 60 GHz bandwidth.

STMicroelectronics is now supplying its latest long-range (77 GHz) radar chips to leading automotive customers.

Sony Corp. has reached an agreement with Altair Semiconductor and its major shareholders to acquire the company. The purchase price is $212 million (approximately 25 billion yen), and Sony expects to complete the acquisition in early February 2016. Altair, an Israel-based company, owns modem chip technology and related software for LTE (Long Term Evolution), a 4G cellular standard for mobile devices. Altair develops and sells products focused on LTE technology, and its modem chips stand out for their low power consumption, high performance and competitive cost.

STMicroelectronics announced what is claimed to be the world’s first 500 Mbaud High-Symbol-Rate (HSR) satellite demodulator chip.

Anritsu Co. announces it successfully completed testing of GCT Semiconductor’s 4G LTE-Advanced chip, GDM7243Q, using Anritsu’s MD8430A signaling tester with Rapid Test Designer (RTD). GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, offers an advanced FDD-TDD LTE Category 5/6/7 single chip, with the world’s first 4X4 MIMO carrier aggregation for LTE.

Analog Devices Inc. introduced a 12-bit, 8-channel ADC/DAC/GPIO combination chip which is user-configurable in any functional combination.

RFMW Ltd. announces design and sales support for the CT2010D from EMC Technology. The CT2010D diamond termination offers 300 W CW power handling in a chip size (2.67 x 5.21 mm), SMT package. EMC Diamond RF Resistives® offer high performance in compact packages. EMC’s CVD Diamond terminations surpass BeO and AlN terminations with operation up to 30 GHz.

Vishay Intertechnology, Inc. introduced a new TANTAMOUNT® Hi-Rel COTS series of surface-mount solid tantalum chip capacitors for military and avionics applications. The industry's first such devices to feature a metal case and hermetic sealing to meet the requirements of MIL-STD-202, Method 112, Condition A, the Vishay Sprague T25 series offers low ESR down to 180 mΩ at +25 °C and 100 kHz and is available with surge current testing options in accordance with MIL-PRF-55365.

Texas Instruments (TI) announced that its SimpleLink™ Wi-Fi® CC3100and CC3200 devices, designed for the Internet of Things (IoT), are now Wi-Fi CERTIFIED™ at the chip level. TI is the first company to have a chip achieve Wi-Fi Alliance® certification.