- Buyers Guide
The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module. The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.
Molex Inc. announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014. Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate. Industry applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and military high data-rate scanning equipment.
Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency. HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance. .
The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair. SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.
Molex Inc. will showcase its deep technical expertise and extensive product portfolio at DesignCon 2014, January 29 – 30, Santa Clara, CA, booth 117. Company experts will conduct technical paper presentations and product demonstrations to illustrate how Molex solutions meet the demand for increased network bandwidth and advanced technology. The company will also have on display a vast representation of its products that support a wide-range of data rates in a variety of connector sizes and shapes.
Koch Industries Inc. has completed its $7.2 billion acquisition of Molex Inc., a global electronic components company.
Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England. ECOC is the largest European optical communications event for the fiber optic industry.
Molex Inc., a global electronics components company, announced that it has completed the acquisition of FCT Electronics Group, based in Munich, Germany. FCT Electronics Group specializes in designing and manufacturing custom mixed-layout connectors and cable assemblies. This strategic acquisition is expected to expand the presence of Molex solutions in the global medical electronics, industrial, telecom and aerospace industries.
Molex Inc., a global electronic components company, announced that it has entered into a definitive agreement to be acquired by Koch Industries Inc., one of the world's largest and most successful private companies. Under the terms of the agreement, Koch Industries will acquire all of Molex's outstanding shares, including the Common Stock (MOLX), the Class A Common Stock (MOLXA) and the Class B Common Stock, for $38.50 per share in cash, for a total equity value of approximately $7.2 billion.
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