Articles Tagged with ''chip''

Ethertronics, a leading technology company enabling innovative antenna and RF system solutions to deliver the best connected experience, announced that the company achieved a more than 50 percent increase in revenue from 2011 to 2012, reinforcing its continued growth in the global market. The company’s solutions are now integrated in more than 1,000 product designs. In addition to its continued momentum in providing products to OEMs worldwide, Ethertronics achieved major milestones in 2012 related to the diversification of its business.

AVX Corp., a leading manufacturer of passive components and interconnect solutions, has introduced a new series of Schottky barrier rectifier diodes uniquely packaged as lead-less chips. Eliminating the standard lead frame wire bond provides the chip with top-bottom symmetry, which enables better heat transfer, better current handling capability than SOD devices, and fewer mounting problems.  Available in several case sizes and a range of current values spanning 0.1A to 8A, the new lead-less chip form Schottky rectifier diodes are ideal for applications including switch mode power supplies, high frequency rectification, portable battery powered devices, and reverse bias protection. 

The new RAVS series from Stackpole offers stable reliable performance in a wide variety of environments including those with high amounts of sulfur. Stackpole’s proprietary process and materials with reduced silver yield a chip resistor array with excellent long-term reliability under conditions where standard chip resistors fail. The RAVS series shows typical resistance shifts less than 0.1 percent after 240 hours at 40C, 95 percent R.H., 5 volt bias, and H2S concentration of 3 ppm or greater.

Recognized throughout the semiconductor and electronic design industries as the premiere annual trade event, DesignCon 2013 is scheduled for January 28-31 in Santa Clara, Calif.  Hosted by UBM Electronics, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 100 in-depth tutorials, technical paper sessions and panel discussions.

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.  

Northrop Grumman Corp. has developed a line of gallium nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs) for military and commercial uses. These devices represent the first commercial availability of GaN-based components from the company.

Florida RF Labs has added broadband resistive power dividers to the HybriX® line of signal distribution products. The new RPD series offers significant advantages over on-board multi-resistor design by providing excellent broadband frequency response, highly repeatable performance, and streamlined assembly process in a monolithic surface-mountable chip package.

Vishay Intertechnology Inc. introduced the industry's first wirebondable thin film chip resistors with compact 40 x 40 mil (1 x 1 mm) footprints to feature high resistance to 100 MΩ. The new CS44 <http://www.vishay.com/doc?60114> series features low TCR down to ± 50 ppm/°C and tolerances to ± 0.5 %.

Sumitomo Electric Device Innovations USA Inc. (SEDU), a provider of advanced wireless and optical communications solutions, will showcase its E-band MMICs for radio link applications at IMS 2012 in Montreal.

Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.