- Buyers Guide
Agilent Technologies Inc. announced that EMPro 2012 will be demonstrated at European Microwave Week (Booth 114), Oct. 29-Nov. 1, RAI, Amsterdam.
Agilent Technologies Inc. announced shipment of EMPro 2012, its 3-D electromagnetic simulation software.
Tech-X Corp. of Boulder, CO announced the release of Vorpal 6.0. New in the release is the customization of Vorpal for targeted industries. With the VSimEM package for electrostatic and electromagnetic problems, VSimMD for the microwave device optimization, VSimPA for plasma acceleration simulations, VSimPD for plasma discharge simulations, VSimBase for the educational market, and VSimPro, which provides the full features of Vorpal, the pricing and use of Vorpal is more flexible and more focused on meeting the needs of customers.
Remcom announces a breakthrough in current industry standards for electromagnetic simulation performance with MPI + GPU technology and unlimited memory support for XFdtd® Electromagnetic Simulation Software (XF7). These capabilities are now available with the latest version of XF7, Release 7.3.1.
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