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Industry News / Materials/Packages / Semiconductors / Integrated Circuits / Test and Measurement

Agilent, Aeroflex Microelectronic Solutions Partner

October 7, 2008
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Agilent Technologies Inc. and Aeroflex Microelectronic Solutions announced a strategic alliance to deliver industry-leading RF and microwave components and Multi-Chip Module solutions for aerospace, satellite and military applications using Agilent’s monolithic microwave integrated circuits (MMIC).

“Agilent is fully committed to helping today’s engineers create the best products for the aerospace and defense market by providing them with the components they need from early development through production,” said Mark Pierpoint, vice president and general manager, Agilent. “This partnership with Aeroflex Microelectronic Solutions reinforces our commitment to the high-reliability market.”

“Aeroflex packaging and test capabilities combined with Agilent’s proprietary MMIC solutions will provide RF and microwave engineers solutions for complex high-reliability communication designs,” said Tom Terlizzi, vice president and general manager, Aeroflex Microelectronic Solutions, Plainview. “This partnership demonstrates Aeroflex’s continued commitment to provide industry leading solutions to the aerospace, satellite and defense markets.”


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