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Industry News

TSMC to Transfer Technology to China

January 9, 2007
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The government of Taiwan has approved the application by the Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) to transfer 0.18 micron generation semiconductor process technology to China for production. TSMC spokesperson and vice president Lora Ho commented, “TSMC greatly welcomes the government’s decision.

The addition of 0.18 micron process technology to our existing 0.35 micron and 0.25 micron process capabilities will help us meet the manufacturing needs of our customers in China, and we believe that we will win more orders and expand TSMC’s market share in China.”

Also, while TSMC will build 0.18 micron semiconductor manufacturing capacity in China in line with government regulations, the company will also expand investment in Taiwan according to its established plans. These include additional construction of advanced 12 inch wafer fabs, as well as continued progress into leading technologies such as the 65 nanometer, 45 nanometer and 32 nanometer nodes.


































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