The Electronic Design Innovation Conference (EDI CON) provides an educational platform for engineers developing components and systems operating at high data rates and RF/microwave frequencies. This one-of-a-kind event brings together the world’s leading RF, microwave and high-speed digital design experts to share state-of-the-art information on the latest semiconductor technologies, PCB materials, processes, components and specialized design tools – simulation software and measurement systems. The peer-reviewed technical conference was developed by the editors of Microwave Journal and is organized by engineering discipline to help attendees further their skills in design, measurement techniques, simulation-based modeling and system integration. The supporting exhibition of leading multi-national, high-frequency electronics manufacturers adds a practical, solutions-based component to the overall event.

Technical Conference and Workshop/Panels

The technical conference is divided into four tracks based on engineering functions that support high frequency electronic component design, verification and system integration. Peer-reviewed papers from industry experts offer insights on a range of topics related to wireless communications, high-speed computing, aerospace and defense systems. Each session offers two, 20-minute presentations on a related topic such as power amplifier design, antenna modeling or TD-LTE. The Design Track explores the latest circuit and component design techniques and architectures with examples of key active and passive devices found in radio front-ends and transceivers for WiFi, small cell, 3G and LTE base-stations, back haul networks, radars, etc. The measurement and modeling track looks at various measurement and simulation techniques used to generate the building blocks that represent the electrical behavior of physical structures and devices in support of virtual prototyping and design verification.  The system integration track looks at various wireless systems and standards, receiver architectures, modulation techniques, etc. to provide a broader overview of the networks driving component requirements and specifications. The commercial resource track provides a mix of vendor-based solutions and products for specific applications and engineering challenges.

The afternoon workshops and panels offer application-based tutorials on a range of topics from RFIC/MMICs and RF/microwave semiconductors to MIMO over-the-air testing.  Workshops and panels provide attendees with an opportunity to interact directly with industry experts through Q&A discussions and some hands-on demonstrations. These sessions are meant to engage all levels of attendees from initial introduction through a more advanced understanding of emerging technologies. Workshop content is developed by technologists from leading component, EDA and T&M manufacturers in collaboration with EDI CON organizers with an emphasis on solutions that address engineering challenges and promotes successful design techniques.


The exhibition hall offers attendees the chance to interact face to face with technologists from leading multi-national companies, directly receive in-depth product information and experience live, hands-on product demonstrations. Exhibiting companies represent a range of technologies supporting the development of RF, microwave and high-speed digital components and subsystems. Test and measurement equipment manufacturers and specialized test systems will offer attendees the chance to learn about instruments for R&D laboratories, production facilities and field testing.  Exhibitor attendees have the opportunity to learn from the experts about non-linear active device characterization and load-pull systems for RF power amplifier design, signal/spectrum and network analysis, real-time oscilloscopes and EMI/EMC test solutions. EDA vendors will be on hand to discuss a wide range of software solutions including RFIC, MMIC and PCB/MIC circuit design and analysis, 3D electromagnetic simulation and system-level tools. Semiconductor foundries, integrated device manufacturers and their representatives will be exhibiting RFICs/MMICs and discrete semiconductor devices covering a wide range of power levels and operating frequencies.

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