- Buyers Guide
TriQuint Semiconductor Inc., an RF front-end product manufacturer and foundry services provider, introduced a new member to its TRIUMF Module™ Family, the TQM7M9070. Its advanced integration technology offers 3G designers building global smartphones and other mobile devices a streamlined RF footprint, through support for multiple modulations and multiple bands in one module. This broadband power amplifier module aligns with ST-Ericsson’s MM5730 and U5500 platforms.
In addition to reducing the component count, the featured power amplifier provides W-CDMA/HSUPA modulation over multiple bands by enabling outstanding Power Added Efficiency (PAE) without requiring a DC to DC converter. Power amplifier PAE is a critical contributor to longer battery life and greatly enhances the user experience of mobile devices.
In close collaboration with ST-Ericsson, all system-critical parameters will be verified as a platform reference design. “Customers can be assured the solution has been tested and works together to deliver a new level of power added efficiency,” said Tim Dunn, Vice President and General Manager of Mobile Devices at TriQuint. “Given the real estate limitations in today’s devices, our new broadband power amplifier module offers a competitive advantage to our customers since it reduces the transmit area by more than 20 percent, and optimizes the electrical RF performance for each unique device.”
TriQuint’s broadband power amplifier supports W-CDMA high bands 1, 2 & 4, and W-CDMA low bands 5, 6 & 8. Its scalability from dual-band to penta-band applications addresses the demand for mid to high-end feature and smartphones. Enabled by TriQuint’s CuFlip™ technology, the broadband PAM inherently manages heat in a remarkably small form factor, 5 x 4 x 1 mm3.
Complementary to TQM7M9070, TriQuint offers a highly-efficient quad-band power amplifier module, the TQM7M5022R, for GSM/EDGE to support a complete amplification solution for any cellular multimode/multiband application.
TriQuint offers the industry’s largest in-house technology portfolio which uniquely enables innovative RF architectures that align with major chipset providers; this broad-breadth portfolio provides device manufacturers qualified, tested and certified solutions. TriQuint will highlight these platform solutions at the telecommunications industry’s largest annual gathering, GSMA Mobile World Congress, in Barcelona, Spain, 14-17 February, 2011.