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TE Connectivity (TE), a world leader in connectivity and sensors, announces its new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.
Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that it has begun alpha testing of Tachyon, its new ultra-low loss product that is engineered to reduce insertion loss on high-peed digital designs. It is specifically being targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market that has channel data rates in excess of 25 Gbps.
Molex Inc. will showcase its deep technical expertise and extensive product portfolio at DesignCon 2014, January 29 – 30, Santa Clara, CA, booth 117. Company experts will conduct technical paper presentations and product demonstrations to illustrate how Molex solutions meet the demand for increased network bandwidth and advanced technology. The company will also have on display a vast representation of its products that support a wide-range of data rates in a variety of connector sizes and shapes.
Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England. ECOC is the largest European optical communications event for the fiber optic industry.
CRFS, a leader in RF spectrum monitoring systems, has announced the launch at DSEI 2013 of its RFeye® Nexus range of wideband receiver modules, featuring class-leading signal interception capability and flexible PCIe interfacing for easy integration into other systems.
Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming DesignCon 2013 conference and exhibition, January 29-30, 2013 at the Santa Clara Convention Center in Santa Clara, California. DesignCon is one of the Printed Circuit Board (PCB) industry’s premier events to learn about the latest advanced products, technologies and developments in the market.
The VITA 67.0, 67.1 and 67.2 standards, which define the RF connector modules for implementation within the OpenVPX™ architecture, have been ratified by the American National Standards Institute (ANSI). TE Connectivity's (TE) RF connector modules, which meet these new standards, have been designed for high-reliability, high-density aerospace and defense applications that meet the vibration, environmental and corrosion resistance requirements of VITA 47.
TE Connectivity (TE), a world leader in connectivity and sensors, announces its new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.