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NXP Semiconductors announced a family of top-side cooled RF amplifier modules, based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure.
The global high power RF amplifier market exceeds a valuation of U.S. $4.6B at present, and is slated to accelerate at an impressive CAGR of 12.3 percent over the forecast period of 2021 to 2031.
