Smiths Interconnect, a division of Smiths Group plc, announces it will exhibit at SATELLITE 2018 in Washington, D.C., March 12 through the 16 in Booth #943.

Smiths Interconnect announced the introduction of the innovative split pair quadrax contact technology to its rugged D-Sub connector series.

Smiths Interconnect announces the release of the SpaceNXT™ Ku Series of high-power WR75 circulators and loads. This  series is specifically designed for MEO/GEO satellites.

TT9 SMT series, a new DC - 20 GHz wideband surface mount fixed attenuator series. The TT9 offers a power handling capability of 500 mW.

Eclipta ECL  connector series addresses the medical market need for a reliable interconnect system with short lead-time and minimal cost. Eclipta connector incorporates an innovative, double-ended, edge card contact system featuring a PCB as the contact on the disposable connector side.

Smiths Interconnect announces the release of the Volta Series probe heads optimized for wafer level chip scale package testing. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.