Smiths Interconnect announced the introduction of its new Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku-Band).

Smiths Interconnect provided Thales Alenia Space with high performance microstrip circulators embedded into the active antenna transmitter/receiver modules, as well as low profile solderless interposers for the core electronics of the first satellite of the COSMO-SkyMed Second Generation.

Smiths Interconnect announces that it has completed the acquisition of Reflex Photonics Inc. to expand in the high speed data-transmission market.

Smiths Interconnect Inc. proudly announces receipt of the James S. Cogswell Outstanding Industrial Security Achievement Award for 2019—the most prestigious honor the Defense Security Service (DSS) may bestow upon the top cleared facilities.

Smiths Interconnect, a division of Smiths Group plc, announces it will exhibit at SATELLITE 2018 in Washington, D.C., March 12 through the 16 in Booth #943.

Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku Band).

The CTX Series is designed to offer excellent broadband performance up to 64 GHz. It allows wider coverage than traditional components.

The SpaceNXT™ MWC Series is specifically designed for a variety of space applications from MEO/GEO satellites to deep space probes.

Re-launched HBB series of single pole high power 300A and 500A circular connectors offer a compact, lightweight and ruggedized heavy duty connector designed.

Smiths Interconnect announces the release of the SpaceNXT™ Ku Series of high-power WR75 circulators and loads. This  series is specifically designed for MEO/GEO satellites.

TT9 SMT series, a new DC - 20 GHz wideband surface mount fixed attenuator series. The TT9 offers a power handling capability of 500 mW.

Eclipta ECL  connector series addresses the medical market need for a reliable interconnect system with short lead-time and minimal cost. Eclipta connector incorporates an innovative, double-ended, edge card contact system featuring a PCB as the contact on the disposable connector side.

Smiths Interconnect announces the release of the Volta Series probe heads optimized for wafer level chip scale package testing. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.