Smiths Interconnect announced receipt of a contract from Mitsubishi Electric Corporation to participate in the development of a G-Band satellite for the Japan Aerospace Exploration Agency.

Smiths Interconnect provides the Mars Perseverance Rover with high performance ruggedized cPCI 2 mm connectors addressing NASA’s need for a high reliability connector solution to meet the mechanical, electrical and environmental performance requirements. 

Smiths Interconnect has been involved in the F-35 Lightning II programme for over 20 years, supplying hundreds of different interconnect devices including high reliability technologies, from RF components and high speed/power/density/filtered connectors to integrated microwave assemblies.

NASA’s Mars Exploration Program, Mars Perseverance Rover was launched on July 30, 2020 and will touch down on Mars on February 18, 2021. Smiths Interconnect provides the Mars Perseverance Rover with high performance ruggedized cPCI 2 mm connectors addressing NASA’s need for a high reliability connector solution to meet the mechanical, electrical and environmental performance requirements.

Smiths Interconnect announced the introduction of its new Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku-Band).

Smiths Interconnect provided Thales Alenia Space with high performance microstrip circulators embedded into the active antenna transmitter/receiver modules, as well as low profile solderless interposers for the core electronics of the first satellite of the COSMO-SkyMed Second Generation.

Smiths Interconnect announces that it has completed the acquisition of Reflex Photonics Inc. to expand in the high speed data-transmission market.

Smiths Interconnect Inc. proudly announces receipt of the James S. Cogswell Outstanding Industrial Security Achievement Award for 2019—the most prestigious honor the Defense Security Service (DSS) may bestow upon the top cleared facilities.

Smiths Interconnect, a division of Smiths Group plc, announces it will exhibit at SATELLITE 2018 in Washington, D.C., March 12 through the 16 in Booth #943.

Planar X Series reduces overall system mass in critical space applications, provides best in class RF performance and more.

Smiths Interconnect announced the introduction of its Joule 20 test socket for Peripheral IC Test. Joule 20 failsafe scrubbing contact technology provides first-class electrical and mechanical performance in testing peripheral ICs for the most demanding applications.

CEX Series offers various configuration options including frequency band, slope direction and slope magnitude are available to support multiple markets and applications.

Smiths Interconnect announced the release of its CTX SMT series of high frequency surface mount chip terminations.

Smiths Interconnect announced the release of patented surface mount outrigger resistors and terminations with improved power handling (Up to 12.5 W.) 

Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku Band).

The CTX Series is designed to offer excellent broadband performance up to 64 GHz. It allows wider coverage than traditional components.

The SpaceNXT™ MWC Series is specifically designed for a variety of space applications from MEO/GEO satellites to deep space probes.

Re-launched HBB series of single pole high power 300A and 500A circular connectors offer a compact, lightweight and ruggedized heavy duty connector designed.

Smiths Interconnect announces the release of the SpaceNXT™ Ku Series of high-power WR75 circulators and loads. This  series is specifically designed for MEO/GEO satellites.

TT9 SMT series, a new DC - 20 GHz wideband surface mount fixed attenuator series. The TT9 offers a power handling capability of 500 mW.

Eclipta ECL  connector series addresses the medical market need for a reliable interconnect system with short lead-time and minimal cost. Eclipta connector incorporates an innovative, double-ended, edge card contact system featuring a PCB as the contact on the disposable connector side.

Smiths Interconnect announces the release of the Volta Series probe heads optimized for wafer level chip scale package testing. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.