David Vye, MWJ Editor
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David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

Stimulus Package Opens Grant Funding for Wireless Broadband

February 16, 2009
The final passing of the American Recovery and Reinvestment Bill by Congress last week calls for over $6 billion in grants for the expansion of broadband areas across America. This funding will provide continued progress in the deployment and adoption of broadband technology that is vital to ensuring that the United States will remain competitive worldwide. As a platform capable of providing access everywhere, wireless broadband will be essential in bringing innovation and helping reach the Obama Administration’s goal of achieving universal broadband connectivity.

Commercial entities are clearly eligible for direct grants from the National Telecommunications and Information Administration (NTIA), go to http://www.ntia.doc.gov/. Commercial wireless hardware vendors and network providers stand ready to move forward with plans to bring wireless broadband to rural and underserved areas. Having direct access to grant funding will allow them to do so in a timely manner, helping create jobs fast, enable productivity, and should help jump-start our economy.
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