Rogers Advanced Circuit Materials (ACM) Division employees will be at IMAPS Device Packaging 2010, offering information on ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® circuit board materials, including the recently launched RO4360™ laminate (6.15 Dk), which many in the field believe is a very effective cost-down replacement for LTCC (low temperature co-fired ceramic) packaging designs.