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Active antennas, or phased arrays, have been widely used for many years. The first phased array applications were mainly military with systems deployed as early as the mid-1970s. Recent industry trends have shown a rapid increase in the use of this technology for both radar and communication systems, along with a push into the mmWave spectrum. This paper will explain the market changes behind these trends and the implications for the future.

In this technical paper, we analyze the architecture, semiconductor technology, and RF front-end (RFFE) design needed to deliver mmWave FWA services. Discussing topics such as: Scan-angle requirements, Tradeoffs of Hybrid-beamforming versus All-Digital Beamforming for the Base Transceiver Station (BTS),Analyze BTS semiconductor technology and RF front-end components, and Gallium-Nitride on Silicon Carbide (GaN-on-SiC) front-end modules (FEMs) designed specifically for the 5G FWA

This article is organized into 3 major topics. In the first section, we will discuss some of the leading use cases for mmwave communications and set the stage for the analysis that follows. In the second and third sections we will delve into the architectures and technology for the mmwave basestation systems. In section 2 we will discuss technology for the beamformers and how the required transmit power influences the choice of technology for the system front-end. While the beamformer gets much of the spotlight in the press, there is equally important section of the radio that performs the conversion from bits to mmwave frequency. We will present an example signal chain for this section of the system and suggest some leading-edge components from Analog Devices for radio designer’s consideration.

EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators in Santa Clara Convention Center on October 17 and 18, announces the finalists in the Outstanding Paper Awards competition for 2018.

NI AWR software will be on display in Booth #212 at the 2018 Electronic Design Innovation Conference & Exhibition (EDI CON) USA, taking place October 17-18 in Santa Clara, Calif.

Rogers Corp. will share its experience and expertise on circuit materials technologies at the 2018 Electronic Design Innovation Conference (EDI CON) USA October 17-18, in Santa Clara, Calif.