StratEdge Corp. will display its high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS and EDI CON USA. StratEdge's packages meet the extreme demands of GaN and GaAs devices and the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test & measurement, automotive, down-hole and MEMS markets.

StratEdge will showcase two options for packaging GaN and high-power semiconductor devices, the LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages dissipate heat and come in fully-hermetic versions in over 200 standard outlines.

StratEdge will also feature its complete line of post-fired and molded ceramic semiconductor packages operating from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards. 

"We are excited to participate in these three industry events," said Tim Going, president of StratEdge. "Since StratEdge started manufacturing packages for semiconductor devices in 1992, we have seen the demand for high speed, high frequency, data-intensive technologies multiply. This is reflected in the interest in these events."

StratEdge will be exhibiting in Booth #309 at the 2018 IMAPS Symposium on Microelectronics, which is being held October 9-11 at the Pasadena Convention Center in Pasadena, Calif. This year marks the 51st annual symposium for this microelectronics industry event.

StratEdge will be exhibiting in Booth #4 at the 2018 IEEE BiCMOS and Compound Integrated Circuits and Technology Symposium (BCICTS), which is being held October 14-17 at the Sheraton San Diego Hotel and Marina in San Diego, Calif. BCICTS is a new symposium that combines the former Compound Semiconductor IC Symposium (CSICS) with the Biploar/BiCMOS Circuit and Technology Meeting (BCTM).

StratEdge will be in Booth #224 at EDI CON USA 2018, being held at the Santa Clara Convention Center, Santa Clara, Calif. from October 17-18. EDI CON USA is the first industry event in the U.S. to bring together RF, microwave, EMC/EMI and high speed digital design engineers and system integrators for networking, product demonstrations, training and learning opportunities.