Industrial/Scientific/Medical Channel

UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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Passive Plus Inc. offers HI-Q/low ESR capacitors in larger case sizes

With over 30 years in the RF/Microwave industry, Passive Plus Inc. manufactures high quality, high power passive components using state-of-the-art manufacturing techniques. Specializing in magnetic & non-magnetic HI-Q capacitors and power resistive product lines, PPI supplies reliable quality components to the aerospace, telecommunications, medical semiconductor, and military industries.


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Richardson RFPD introduces digital-to-analog converter from ADI

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new digital-to-analog converter (DAC) from Analog Devices Inc. (ADI). The AD5780 is a true 18-bit, unbuffered voltage output DAC that operates from a bipolar supply of up to 33 V, offers a relative accuracy specification of ±1 LSB maximum range, and guarantees monotonic operation with a ±1 LSB DNL maximum range specification.


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