Materials/Packages/Substrates

Supreme 12AOHT-LO

Supreme 12AOHT-LOSupreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable epoxy has formidable bond strength, particularly in the shear mode, ranging from 3,400-3,600 psi. Its service temperature range extends from 4K to +260°C. 


Read More

Aqueous Based Sodium Silicate Coating: MB600S

mb600sMaster Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required.Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with a shielding effectiveness of 95 to105 dB, from 1 to 2 GHz.


Read More

Thermoset Circuit - High-Frequency Laminates: RO4830

rogers-laminate_automotiveRogers Corp. announced an addition to its RO4000® Series thermoset circuit materials: RO4830™ high-frequency laminates. RO4830 laminates offer 76 to 81 GHz auto radar sensor designers a lower-cost-but-performance-competitive option. Rogers RO4830 laminates have a lower price point and are processed by means of standard epoxy/glass (FR-4) circuit fabrication methods, for lower overall production costs versus PTFE-based circuits.


Read More

High Temperature Resistant Coating System: MB600G

mb600gIdeal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications because of their balance of shielding effectiveness and cost effectiveness.


Read More

UL 94 V-0 Antenna-Grade Laminates: RO4730G3™

RO4730G3™Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.These flame-retardant (per UL 94V-0), thermoset laminate materials are an extension of Rogers’ dependable RO4000® circuit materials.


Read More

92ML™ Materials

rogers-92ML Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics.


Read More

Broadband 5 MM C-QFN

QFN_ModelithicsBarry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5 mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40 GHz. The model features 64 ports for the inner and outer connections of each pin and two model package options depending on the design configuration.  The Modelithics model is validated with a comparison to actual measured data.


Read More

Circuit Board and Packaging

TMS Circuit Board & PackagingTeledyne Microwave Solutions has developed an innovative low cost custom packaging solution utilizing Teledyne Labtech's established microwave printed circuit board techniques and the use of low cost organic materials for single chip and MCM (multichip module) applications. Markets served include defense, aerospace, and telecommunications. TMS' cavity package demonstrates excellent high frequency, thermal and electrical characteristics. 


Read More

Frozen Epoxy Pre-forms

frozen epoxyLaser Services stocks and delivers a variety of high-performance frozen epoxies from Ablestik, Emerson & Cuming and Henkel. The products' performance is ideal for microwave and heat sink applications. In bonding microwave substrates into packages, it provides RF/EMI shielding. Its high thermal conductivity is desirable for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
 


Read More