TMS Circuit Board & PackagingCircuit Board & Packaging

Teledyne Microwave Solutions is one of the world's leading manufacturers of microwave circuit solutions with specialist capabilities in design, manufacturing, assembly, and testing across many technologies and products.

MMIC Packaging

Teledyne Microwave Solutions has developed an innovative low cost custom packaging solution utilizing Teledyne Labtech's established microwave printed circuit board techniques and the use of low cost organic materials for single chip and MCM (multichip module) applications. Markets served include defense, aerospace, and telecommunications.

Key Features

TMS has developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimization of short bond wire lengths ensures minimal loss of chip performance.

MMIC Packaging at-a-glance

  • Single chip & multi chip module (MCM) solutions
  • LCP packages
  • Competitive pricing for high and low volume quantities
  • Excellent thermal performance >7w dissipation
  • Excellent RF performance at Ka band
  • Low cost tooling and short lead times for new designs
  • Perfect for auto assembly process
  • Available as SMD, BGA, drop in and flange configurations
  • Flexible footprint and cavity changes available·     



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