Semiconductors / Integrated Circuits

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Agilent Technologies Inc. and Altair Semiconductor announced they will jointly conduct interoperability testing and validation testing using Altair’s 4G LTE chipset in conjunction with the Agilent PXT wireless communications test set and N6070A-series signaling conformance test software. The joint effort will accelerate the development of LTE devices and testing...

RF Micro Devices Inc. (RFMD) announced the company will present a broad selection of industry-leading radio frequency (RF) components for the global mobile device market at the 2011 Mobile World Congress (MWC) in Barcelona, Spain, from February 14 to February 17, 2011. The RF components to be highlighted by...

Fujitsu Semiconductor America Inc. (FSA) will showcase the latest in its portfolio of mobile device semiconductor solutions at the Mobile World Congress held in Fira de Barcelona-Recinto Montjüic on February 14-17, at the Fujitsu booth in Hall 1.0, Stand No. 1F69. 2G/3G/4G RF Transceivers Fujitsu will present reference designs...

Skyworks Solutions Inc. , an innovator of high reliability analog and mixed signal semiconductors enabling a broad range of end markets, and Ember Corp. , a provider of low power, wireless mesh networking technology, introduced innovative solutions for ZigBee® applications targeting the growing energy management, home area network and...

TriQuint Semiconductor Inc. , an RF front-end product manufacturer and foundry services provider, introduced a new member to its TRIUMF Module™ Family, the TQM7M9070. Its advanced integration technology offers 3G designers building global smartphones and other mobile devices a streamlined RF footprint, through support for multiple modulations and multiple...

After covering DesignCon last week, we now turn our attention to Mobile World Congress Feb 14-17 in Barcelona. PicoChip has announced a SoC technology that integrates the key components of a 3G femtocell into an a QFN package. PicoChip Technology for Base Stations