Semiconductors / Integrated Circuits - Articles - Page 19

Advanced Packaging: the Pandora Box for All the Players of the Semiconductor Industry

September 23, 2021

Yole Développement announced a US$47.5 billion market in 2026, with a CAGR 2014-2026 of 7.4 percent. The share of advanced packaging in the total semiconductor market is increasing continuously: almost 50 percent of the market by 2026.

IQM of Finland Places Multi-system Order for Veeco’s Atomic Layer Deposition System

September 22, 2021

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Veeco Instruments Inc. announced that IQM Finland OY has selected the plasma-enhanced Fiji® Atomic Layer Deposition (ALD) System to help drive the future of quantum computing.

Sivers Semiconductors Launches New State-of-Art 5G NR mmWave RFICs and Very High-Powered RF Modules

September 22, 2021

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Sivers Semiconductors AB announced the launch of the new highly integrated, state-of-art 5G NR RFICs, TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands.

GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products

September 15, 2021

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GlobalFoundries and Qualcomm collaborate on cutting-edge 5G solutions to deliver breakthrough coverage and ubiquitous mobility.

GlobalFoundries Unveils Innovative Solutions that Deliver New Era of More in Semiconductor Manufacturing

September 15, 2021

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New solutions announced at GlobalFoundries' GF Technology Summit include rich features essential for smart mobile devices, datacenter, IoT and automotive.

LIGENTEC and X-FAB Collaboration Creates Europe’s Largest Capacity Foundry Service for PICs

September 14, 2021

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LIGENTEC and X-FAB Silicon Foundries have announced a strategic partnership resulting in the large-scale supply of integrated photonic devices.

X-FAB Becomes First to Offer High Volume MTP Capabilities Following Licensing Agreement with X-Celeprint

September 7, 2021

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X-FAB Silicon Foundries is now able to support volume heterogeneous integration via micro-transfer printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint.

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications

Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021

August 26, 2021

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ACM Research, Inc. announced the launch of ACM’s Ultra ECP GIII plating tool to support wafer-level packaging for compound semiconductors, with product offerings for SiC, GaN and GaAs.

Tower Semiconductor and Cadence Announce New Reference Flow

August 16, 2021

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Cadence Design Systems, Inc. and Tower Semiconductor announced the release of a silicon-validated SP4T RF SOI switch reference design flow using the Cadence® Virtuoso® Design Platform and RF Solution.