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NXP Semiconductors N.V. officially announced its secure fine ranging chipset, SR100T–designed to bring remarkably precise positioning performance tailored for next-generation UWB-enabled mobile devices.
Cree's previously announced $1 billion SiC and GaN wafer fab will be built in upstate New York, not North Carolina, after New York offered $500 million in incentives.
NYU WIRELESS has appointed Thomas Marzetta–the originator of antenna technology that is enabling vast improvements in wireless communications–as director of the world-recognized research center at the NYU Tandon School of Engineering.
Anritsu will showcase leading-edge test solutions for emerging 5G, satellite and signal integrity applications while highlighting its VNA cutting-edge technology at EuMW 2019 in Paris from October 1-3.
Addressing the unprecedented demands of the aerospace and defense industry, Mathias Vetter, product manager at HUBER+SUHNER will present the long-line of benefits to the Spuma RS FR at European Microwave Week (EuMW) 2019.
Over the past three years, DARPA’s Spectrum Collaboration Challenge (SC2) has relied on a custom-built virtual testbed called the Colosseum to host thousands of competitive matches and scrimmages, which will include the final match to determine the winner of the $2 million grand prize.
RFMW announces that Philip Knights has joined their organization as business development manager, RF Power products, and David Markman has joined as director of business development, Mil Aero.
Three important channel modeling components, spatial consistency, human blockage, and outdoor-to-indoor (O2I) penetration loss, are implemented in NYUSIM 2.0.
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