RF & Microwave Industry News

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Purdue University engineers have addressed an issue barring the development of quantum networks that are big enough to reliably support more than a handful of users. The method could help lay the groundwork for when a large number of quantum computers, quantum sensors and other quantum technology are ready to go online and communicate with each other.

The successful SignalShark family from Narda Safety Test Solutions has powerful support in handling the many challenges involved in effective radio monitoring and direction finding of interference signals, and will from now on primarily take on the job of 24/7 radio monitoring, particularly in the open air.

Impulse Technologies, Inc. announced a new line of wideband horn antennas from RFspin that are well suited for emerging applications in 5G cellular wireless communication systems and mmWave commercial vehicular radar systems.

Radio RF Conformance Test System ME7873NR is an automated test system for 5G NR RF tests specified by 3GPP TS38.521. 

Smiths Interconnect provides the Mars Perseverance Rover with high performance ruggedized cPCI 2 mm connectors addressing NASA’s need for a high reliability connector solution to meet the mechanical, electrical and environmental performance requirements. 

Smiths Interconnect has been involved in the F-35 Lightning II programme for over 20 years, supplying hundreds of different interconnect devices including high reliability technologies, from RF components and high speed/power/density/filtered connectors to integrated microwave assemblies.

Artech House announced the publication of Electromagnetic Diffraction Modeling and Simulation with MATLAB® by Gökhan Apaydin and Levent Sevgi, an introduction to the fundamentals of diffraction of two-dimensional canonical structures including wedge, strip and triangular cylinder with different boundary conditions.

Infineon Technologies AG's newly developed AIROC™ brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC.

Teledyne SP Devices announced the release of ADQ32 and ADQ33—a fourth-generation modular data acquisition boards optimized for high-throughput applications.