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Harris Stratex Networks is expanding its operations in East Africa, adding sales and engineering support in its Kenya facility and opening a new office in Tanzania. The aim is to support telecommunications suppliers in the region as they build next-generation networks. To do so they require advanced and comprehensive...

Auriga Measurement Systems LLC announced the hiring of Bruce L. Cohen as president and CEO. Cohen joins Auriga with more than 35 years of industry experience and a proven track record of leading companies to rapid revenue growth and profitability. As one of the founders of Chipcom Corp., an...

TriQuint Semiconductor Inc. , a GaAs foundry supplier, introduced TQBiHEMT, its latest foundry process for wireless/RF design engineers. This new manufacturing capability combines two of TriQuint’s previous processes, offering designers one technology to integrate previously incompatible functional blocks onto a single die, reducing part count, saving board space and...

Comtech Telecommunications Corp. announced that its Melville, New York-based subsidiary, Comtech PST Corp. , has received $5.6 M in orders from a domestic prime contractor to supply broadband, solid-state, high power radio signal jamming amplifiers. These amplifiers, which include the latest solid state transistor technology and provide for very...

Tyco Electronics Corp. has been selected by Raytheon Network Centric Systems as a key supplier on the Multi-Function Radio Frequency System (MFRFS). Raytheon has developed MFRFS as the common radar for Future Combat Systems manned ground vehicles. This teaming integrates Tyco Electronics' advanced MIL600 connector as the main I/O...

Modelithics Inc. has released an enhanced version of its powerful and feature-rich Non-Linear Diode Model Library for AWR -Microwave Office. This Modelithics NLD Library™ upgrade adds several new models for packaged and chip level Aeroflex/Micrometrics Pin Diode products with feature and documentation updates to previously released models. With this...

RF Micro Devices Inc. (RFMD) announced the establishment of the Multi-Market Products Group (MPG), following RFMD's successful completion of the acquisition of Sirenza Microdevices Inc. MPG will be led by Bob Van Buskirk, former president and CEO of Sirenza. MPG joins the Cellular Handset Products Group (CPG), led by...

The first stone has been laid at the site of STMicroelectronics’ future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government and other dignitaries. The site will consist of up to 40,000 m 2 of manufacturing space,...

The partnership between S.E.T. (formerly the SUSS MicroTec Device Bonder Division) and CEA Leti has resulted in a radically new generation of high accuracy (0.5 μm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. The bonder includes a built-in chamber for collective reflow in...

In conjunction with leading Indonesian operator PT Telekomunikasi Selular (Telkomsel), Ericsson has announced the deployment of the latest evolution in low-energy telecommunication solutions — a solar-driven and energy-efficient main-remote GSM base station. The breakthrough deployment will provide macro coverage in the untapped areas of Sumatra and address the mobile...