Articles Tagged with ''design''

 API Technologies Corp., a leading edge provider of high performance RF/microwave, power, and security solutions for critical and high-reliability applications, announced the addition of a new multi-octave broadband amplifier, model BXHF1084, to its growing family of standard and configurable RF/microwave products. With its high frequency capabilities and one of the industry’s smallest footprints, the product offers OEMs competitive advantage and faster time to market. 

 From Knowles Capacitors comes a Wilkinson power divider from their Dielectric Laboratories (DLI) facility.  It is designed to provide in phase power splitting or combining over a broad bandwidth in low power applications.  This is achieved by application of precision thin film fabrication with integrated resistors, coupled with DLI’s high permittivity ceramic materials, to provide a high performance and repeatable design solution. 

 RFMW Ltd. announces design and sales support for P1dB's P1-AMP00010-1-SMA, a DC to 10 GHz, 1 W, amplifier module. The P1-AMP00010-1-SMA is commonly used as a general purpose, broadband amplifier in test and measurement applications but also finds use in system integration projects where flat gain over broad bandwidth are needed. 

 NI (formerly AWR Corp.) has added locations in Asia Pacific for its AWR Design Forum 2014 (ADF 2014).  

 RFMW Ltd. announces design and sales support for a 50 ohm absorptive switch from TriQuint. The TQC0015 internal terminations can handle a maximum CW power of up to 2 W.  

 Custom Interconnects, LLC announced the release of the most detailed RF characterization conducted to-date on their flagship Fuzz Button® technology platform. 

 NI (formerly AWR Corporation) has released V11.01 of the NI AWR Design Environment™ with enhancements to Analyst™ 3D finite element method (FEM) EM simulation engine that cuts simulation times by as much as 70 percent over previous versions.  

 Isola Group S.a r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), today announced that its technical staff would offer a conversion service for PCB fabricators of radio frequency (RF) and millimeter-wave applications.  

 Agilent Technologies Inc. announced its 5G test summit with Future Mobile Communication Forum explored the status of next-generation 5G wireless communication systems. The June 24 forum in Beijing focused on the challenges test and measurement manufacturers face to support this rapidly evolving technology as well as the progress of research in the field.