Articles Tagged with ''solder''

Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.  

Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.

Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 

Indium Corp. introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0) material is especially suited for assembly processes in which the components don’t allow for proper outgassing of volatized flux.

ITT Exelis received National Security Agency (NSA) certifications for its SideHat and the Soldier Radio-Rifleman (SR-R) radios. Certification allows the radios to operate up to the "SECRET" level and be fully integrated into the U.S. Army's tactical communications network. 

International Manufacturing Services Inc. (IMS), a manufacturer of high quality thick film resistors, terminations, attenuators, couplers, thermal management devices, planar dividers and planar filters to the electronics industry, has introduced a new type of chip resistor terminal which are non-magnetic and ultra leach resistant.

Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.

Engineers at IMS 2012 in Montreal, Canada looking for guidance on how best to employ lasers to aid in cutting, drilling and ablating materials will find help from the Laser Services team in booth #215. One such technique being adopted around the microwave industry is using laser ablation to create solder dams on circuits.