IMS2026 Show Preview

Check out what's in store for IMS2026 in this show preview covering products expected to be on the expo floor. 

Aaronia 

At its booth 23045 in Hall A, Aaronia AG will showcase the latest innovations in high-frequency measurement technology, featuring state-of-the-art test and measurement equipment and accessories, to the more than 8,000 expected visitors from over 55 countries.

In addition to the USB-based real-time spectrum analyzers of the SPECTRAN® series—flexible, customizable, and extremely powerful solutions—Aaronia, as a full-range supplier, will showcase RF expertise made in Germany with its high-end accessory line.

Altum RF 

At Booth #22020,  Altum RF company leaders will be in the booth to answer questions about specific products, future plans and their decades of experience designing and delivering RF, microwave and mmWave semiconductors. With over 40+ GaAs and GaN MMICs from X-band to over 100 GHz, Altum RF will feature several products at IMS, including new components for satcom, telecommunication (with E-band), radar, and test and measurement markets. Highlights include Altum RF’s E-band family of power amplifiers and LNAs support today’s demanding mmWave telecom and SATCOM applications by offering high output power and gain for longer-range links. The E-band PAs include an on-chip integrated power detector.

Product highlights:

• ARF1221Q2: 6 - 18 GHz LNA, 1 dB NF, QFN package
• ARF1224Q2:  DC -18 GHz LNA, 1.6 dB NF at 10 GHz, QFN package
• ARF1219Q2: 17.7 – 21.2 GHz LNA, 1.4 dB NF, QFN package
• ARF1120Q3: 15 – 24 GHz Driver Amplifier, 22 dBm Output P1dB, QFN package
• ARF1121Q3: 27 – 31 GHz Driver Amplifier, 22 dBm Output P1dB, QFN package 
• ARF1018: 71-79 GHz E-band Power Amplifier, 1.8 W Psat, Bare Die
• ARF1019: 81-86 GHz E-band Power Amplifier, 1.6 W Psat, Bare Die
• ARF1206:  71-86 GHz Low Noise Amplifier, 2.5-3.5 dB NF from 71-86 GHz, Bare Die.

Amphenol Microwave

Times Microwave Systems, SV Microwave, Micro-Coax, Q Microwave, XMA Corp. and Amphenol Printed Circuits will converge at the 2026 IEEE MTT-S International Microwave Symposium (IMS), June 9–11, at the Thomas M. Menino Convention & Exhibition Center in Boston, Mass., exhibiting together for the first time under the Amphenol Microwave banner. Visitors can find Amphenol Microwave at Booth #16054 in a 20 x 40 ft. island where all six business units will be ready to help engineers explore the full RF signal chain, enter to win a drone and catch a must-attend technical workshop in Room 154.

The Amphenol Microwave island booth brings together representatives from the six business units in a single, collaborative space. Attendees can explore the full spectrum of high-performance RF interconnect solutions across cables, connectors, assemblies, filters, and printed circuits, all in one visit. Booth amenities include:

• A complimentary coffee, tea and water beverage bar to fuel productive conversations throughout the day
• A happy hour event hosted on one of the show days featuring mobile bar carts
• A chance to win one of three drones by visiting one or more business units, having your badge scanned and collecting entry tickets. Hit all six stops for the best odds of winning.

Beyond the booth, six of the industry’s sharpest RF minds will come together on the IMS2026 workshop stage, and the topic could not be timelier: "Next-Generation RF Components: Strategies to Minimize Loss, Noise & Distortion" will take place Thursday, June 11 from 1:30 p.m. – 3:10 p.m. in Room #154. This panel discussion presents one technical expert from each business unit for a deep dive into the strategies and component-level innovations that drive down loss, noise and distortion in today’s most demanding RF systems.

ATEK MIDAS

ATEK MIDAS will unveil 12 new MMIC components in booth #11044. Designed for demanding defense, aerospace, test & measurement and commercial applications, the 12 new MMIC products from ATEK Midas include wideband High IP2 low noise amplifiers, GaN power amplifiers, digitally tunable & switched filters and high power GaN switches along with custom IC design and development services. 

Products featured in the live product demonstration area include their new Digitally Tunable MMIC Filters and Switched Filter Bank Modules. ATEK MIDAS has partnered with Signal Hound to feature their VNA400, a high-performance, USB-powered, 40 GHz, 2-port, vector network analyzer to demo several ATEK MIDAS products.

ATEK MIDAS announced the appointment of R. Connors Sales (RCS) as their exclusive technical representative serving customers in the New England region, MA, ME, NH, VT, RI, and CT(Excluding Fairfield County, CT.).

CML Micro

Visitors to Booth #21082 will have the opportunity to engage with CML Micro’s executive leadership, engineering, product management, sales and marketing teams to discuss emerging market requirements, system-level design challenges and next-generation RF application development. Throughout the event, Rob Smith, Product Line Director, will also host live demonstrations of CML Micro’s MMA-445933H-55 amplifier, highlighting its industry-leading linearity performance for demanding communications and high-reliability applications. 

CML Micro’s presence at this year’s event reinforces the company’s deep system level expertise in delivering high-performance RF and mmWave solutions, including RF gain blocks, GaAs/GaN power amplifiers, low noise amplifiers, ultra-linear amplifiers, synthesisers, modulators/demodulators, and IF & RF transceivers. Its comprehensive portfolio enables engineers to simplify integration and accelerate development across demanding communications, mission-critical and high-reliability RF applications.

In addition to its established product portfolio, CML Micro will provide visitors with an exclusive preview of four upcoming products, cementing the company’s continued investment in advanced RF technology. Scheduled for commercial release over the coming months, these new solutions further bolster the company’s growing RF and mmWave roadmap:

• CMX90A002 – a new compact RF amplifier optimised for maximum efficiency at a wide range of bias voltages from 1.9V to 4.5V and designed to simplify integration for IoT, smart metering and other high-volume, low-power applications.
• MMG-004030 – a high-performance distributed GaN amplifier delivering true wideband operation from below 1 MHz to 40 GHz, with significantly increased output power for instrumentation, electronic warfare and test applications.
• CMX90A301S5 – a next-generation compact linear GaN power amplifier with 10W of saturated output power optimised for MANET radios, mesh networking and advanced military communications systems.
• MWT-11F89 – a new SOT-89 packaged, high-linearity GaAs FET   with 1.5W output power, supporting long lifecycle aerospace and defence applications in one of the RF industry’s most popular, space-saving footprint.

Supporting applications ranging from military and tactical communications to broadband wireless infrastructure, satellite communications, industrial systems and advanced RF design, the solutions on display highlight CML Micro’s position as a trusted partner for high-performance, mission-critical and mmWave system development.

ConductRF 

Meet with the ConductRF team at Booth #16095 and explore their unique capability to deliver rapidly tailored flexible, semi-flexible, handformable and semi-rigid RF cable assembly solutions. Live, personalized demonstrations of their MAESTRO RF Cable Composer will be provided.  The company recently announced the launch of their new True VNA Precision Test Cables family offering high performance, ruggedized, flexible solutions operating to 120 GHz. They’ll also be sharing their latest achievements in delivering extra-long length D38999 multi-signal harnesses and the latest capabilities of their engineering-driven MAESTRO™ RF Cable Composer.

Element6

At IMS, Element6’s (E6) Thomas Obeloer will be available to speak about chemical vapor deposition (CVD) synthetic diamond heat spreaders that deliver superior thermal management, enabling enhanced system performance, stability and device longevity. 

E6 is driving real momentum across the semiconductor ecosystem. Built for a world beyond thermal bottlenecks, its CVD solutions enable higher power levels and faster processes: 

• WSC - Wafer single crystal diamond heat-spreaders to reduce cooling requirements in high‑powered devices 
• Cu-Diamond - a new high-performance copper-diamond composite for demanding thermal management applications 
• Diafilm TM - CVD diamond for semiconductor thermal management solutions 
• ELSC Series - Electronic grade diamond for detector and quantum technologies. 

Elite RF

Elite RF will showcase its broad portfolio of RF amplifier modules and systems at Booth #16025 during IMS 2026. The company is among the few U.S.-based manufacturers with the capability to develop RF power systems up to 200 kW and is actively collaborating with defense industry system integrators on high-power system programs. These developments over the past year have positioned the company at the forefront of advanced RF technology.

The new capabilities are designed to meet the increasing demands of 5G infrastructure, radar systems, satellite communications, and electronic warfare applications requiring higher power density, wider bandwidths, and long-term operational reliability.

Emerson 

Emerson will be launching its new, cost-effective NI Core VST, which combines a vector signal analyzer and a vector signal generator into a single instrument for calibrated RF measurements. The company will also be highlighting its recent NI CHESS platform for high-fidelity RF channel emulation and its NI USRP X420, a new software defined radio product for emerging research.

The new Core VST instruments — including the PXIe-5841 and PXIe-5820 — deliver calibrated, synchronized RF measurements in a modular platform optimized for speed, automation and ease of use. By combining high-performance RF capability with a more accessible price point, the enhanced NI VST portfolio now enables more engineering teams to adopt advanced measurement techniques earlier in development and then scale them up through production with consistency and efficiency.

The PXIe-5841 features 200-megahertz instantaneous bandwidth and a fixed FPGA configuration, providing a streamlined option for fast, repeatable measurements. Alongside the PXIe-5820, these instruments integrate with the NI RFmx measurement software to deliver validated results in a simple, interactive environment that supports more efficient workflows from signal generation through analysis.

FMAX Technologies, Inc.

FMAX Technologies, Inc. will showcase its next-generation 90 GHz sample-and-hold (SH) and time-domain reflectometry (TDR) integrated circuits. FMAX’s upcoming 90 GHz devices leverage extensive in-house expertise with the Cadence EMX 2.5D electromagnetic (EM) solver, a key tool used across the RF-to-mmWave design community for high-accuracy electromagnetic modeling. Cadence highlights EMX as part of its advanced RF design suite showcased at IMS2026, underscoring its relevance for next-generation mmWave IC development. Attendees are invited to visit Booth #11047 to meet the engineering team and discuss sampling plans for Q4 2026. 

HYPERLABS 

HYPERLABS will exhibit at the IEEE MTT-S International Microwave Symposium (IMS), booth 16019, where the company will introduce its new TDR11100 Time Domain Reflectometer alongside its expanding portfolio of 0.8 mm components supporting operation up to 145 GHz. Designed to meet the increasing demands of RF and high speed interconnect environments, the TDR11100 delivers precise time-domain analysis for signal integrity characterization in ultrahigh-bandwidth systems. Attendees are invited to experience live, in-booth demonstrations showcasing these capabilities in real world measurement scenarios. 

Also featured at IMS is HYPERLABS’ 8800 Series of ultra-broadband components, including DC Blocks, Attenuators, and a Balun, each utilizing 0.8 mm connectors and validated for performance up to 145 GHz. First previewed earlier this year, these components have already gained strong industry recognition for enabling accurate measurement and validation beyond 110 GHz. 

Indium Corporation

At IMS2026, booth 21054, Among its featured products, Indium Corporation will showcase:

• AuLTRA^® 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thick gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA^® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA^® product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
• AuLTRA® DA0001 offers the new gold standard—the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
  • Highly accurate thickness control
  • Precise edge quality
  • Optimized cleanliness
  • Default waffle pack method
  • Available for gold-based alloys.

Additionally, Indium Corporation will feature the following gold-based die-attach solutions:

• AuLTRA^® ThInFORMS^® are 0.00035"-thick (0.00889 mm or 8.89 μm) 80 Au/20 Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA^® ThInFORMS^® help combat common issues such as shorting and poor thermal transfer.
• AuLTRA® Fine Ribbon is the company’s Indalloy^®182 fine-grade precision ribbon for high volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance, along with long continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process, resulting in a high-quality end product and a lower cost of ownership.
• AuLTRA^® 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste, optimized to handle the elevated processing temperatures of gold-based alloys. Perfect for high-power LED module array assemblies, it ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA^® 3.2 delivers superb wetting and low voiding.
• AuLTRA^® 5.1 is a no-clean AuSn solder paste, specifically formulated to endure the higher temperatures required by Au-based alloys. Ideal for high-power LED module array assemblies, this formulation provides a broad processing window and consistent print definition, even for ultra-fine pitches. Additionally, AuLTRA^® 5.1 excels in wetting performance and void minimization, while meeting rigorous printing and reflow standards.

Insulated Wire

IW will be showing their extreme low loss cables and assemblies, Re-Flex — the ultimate hand-formable cable and high RF power coaxial cables. IW products meet the requirements of a wide range of applications such as aerospace, space, medical, defense and telecommunications. Of note at the exhibition will the 1 mm cable assemblies using their series of precision low loss coaxial cables, engineered for superior performance in high-frequency applications and operating seamlessly up to 110 GHz. This series stands out for its advanced material and design choices, making it a premier solution for applications requiring high precision and minimal signal loss. Visitors to the IW booth will also be able to collect four new product brochures.

Integra Technologies

Attendees are invited to visit Integra at Booth #21029 to experience the latest breakthroughs in high-power RF technology. Extending its lead in high performance RF power, Integra will showcase two of its latest industry first products: 10 kW 150 V HV GaN/SiC transistor operating at UHF and a10 kW 150 V HV GaN/SiC transistor operating at UHF L-Band — new performance standards that redefine what is possible for solid-state vacuum electron device replacements and other applications.

Integra's booth will also feature its latest generation of RF pallets — solutions engineered to solve the most demanding RF high-power challenges across UHF, L-band, S-band, C-band and beyond. These plug-and-play pallet platforms reduce design time and accelerate time-to-market, making them the go-to choice for OEMs designing high performance radar, scientific, avionics, industrial, air traffic control, medical systems and high-power microwave/directed energy systems.

Rounding out the exhibit, Integra will highlight its HV GaN/SiC pallet-amplifiers with integrated digital control — an advanced platform that puts intelligent monitoring, control and protection capabilities directly in the hands of system designers. By combining the power density of HV GaN/SiC technology with digital control interfaces, these pallet-amplifiers unlock a new level of integration, efficiency and operational flexibility for demanding microwave system applications.

International Manufacturing Services, Inc. 

International Manufacturing Services, Inc. (IMS) is exhibiting with a variety of its high frequency components ideal for use in broad temperature ranges. Showing component solutions such as miniature resistors and temperature-variable attenuators (TVAs), IMS is welcoming visitors to Booth #12059 with advice and guidance on how to achieve stable high-frequency performance over wide operating temperature ranges. 

The exhibition portion of the Symposium is scheduled for June 9th - 11th. Among their product lines on display, the TFI chip resistor series has been extended to 67 GHz, available in compact 0201 and 0402 packages for use in the densest PCBs and circuit assemblies. And for attenuation that remains consistent across wide temperature ranges, IMS’s thin-film TVAs provide carefully designed attenuation versus temperature from -40 to +125°C to help balance the amplitude versus-frequency responses of high frequency systems over wide operating-temperature ranges and adverse operating conditions.  

Visitors  can learn more about the TVAs by visiting the booth or by attending a MicroApps presentation by IMS Applications Engineering Manager, Wes Laquerre: “Demystifying N: Improving Temperature-Variable Attenuation Selection by Modeling Temperature Reduction.” Scheduled for DAY, TIME, in the Exhibition Hall’s MicroApps Theatre, the technical presentation will explore how TVAs can stabilize electronic performance even in challenging aerospace, maritime, and terrestrial systems operating to 20 GHz and higher.  

Junkosha 

At this year's IMS event, Junkosha will be launching a new product, its MWX009 Microwave/mmWave Coaxial Cable Assembly. The MWX009 has been developed to support broader probe system applications as the industry transitions toward higher-frequency testing infrastructure. This new solution is expected to address growing market demand for advanced probe system measurements using 0.5mm and 0.8 mm connector interfaces.

The demand for data bandwidth is driving communication research into the D-band. With this, systems require specialized D-band probe stations and vector network analyzers (VNAs) to characterize channel behaviors and antenna modules at what are extreme frequencies. As such, engineers are increasingly requiring cable solutions that maintain signal integrity for higher-frequency probe setups beyond the current industry norm of approximately 145 GHz, that can reliably provide accurate measurement for testing and validation.

The MWX009 is positioned as a response to this shift, supporting emerging 0.5 mm and 0.8 mm interface requirements and enabling operation up to 190 GHz for 0.5mm and up to 167 GHz for 0.8mm.

K-PA Inc.

K-PA Inc. (Korea Power Amplifier Innovator), a specialized RF semiconductor company, announced its participation at the International Microwave Symposium (IMS2026) in Boston. Exhibiting at Booth #24016, K-PA will introduce its latest X-Band Gallium Nitride (GaN) Monolithic Microwave Integrated Circuit (MMIC) portfolio, headlined by its revolutionary integrated single-chip Front-End Module designed to redefine active electronically scanned array radar architectures. 

Alongside this breakthrough innovation, K-PA will showcase its fully production-ready high-power amplifiers and introduce its official Custom GaN MMIC Design Service, offering global defense and aerospace OEMs a unique combination of cutting-edge tech, secure volume supply, and flexible tailoring. 

Microchip 

Microchip is once again exhibiting with demos showcasing our RF/MW solutions across the signal chain including power management and timing:

• Global Navigation Satellite System Disciplined Oscillator (GNSSDO) provide ultra-low phase noise performance in applications like radar, test & measurement
• Embedded Atomic Clock
• GaN on SiC Monolithic Microwave Integrated Circuits (MMIC) Power Amplifiers
• Voltage-Controlled SAW Oscillators (VCSOs)  

Location: Microchip Booth #19070

Microsembly

Microsembly will exhibit at the IEEE International Microwave Symposium (IMS) 2026 from June 9 to 11 in Boston, Massachusetts (Booth 11015, Thomas M. Menino Convention and Exhibition Center). Engineers, program managers, and procurement leaders are invited to Booth 11015 to connect with Microsembly's team and explore how the company supports RF and microwave hardware programs across commercial, defense, medical, industrial, and research applications.

MilliBox

MilliBox introduces the Fast Synchronized Trigger (FST) feature for its GIM04 and GIM05 modular positioner series. FST accelerates the capture of 3D antenna radiation patterns. FST is demonstrated at IMS in the most compelling OTA setup. The setup shown consists of MilliBox MBX32CTR Compact Antenna Test Range (CATR) with the positioner GIM04F-300EV equipped with FST; the new Copper Mountain Technologies Frequency Extension Base BFx-02 and a pair of the new Virginia Diodes VNAX TxRx WR-10 frequency extenders for W-band in their M2 form factor ideal for 3D OTA captures. This demonstration shows an accelerated live capture of an AUT operating from 75 GHz to 110 GHz.

MilliBox demonstrates the usage of MBX32R with fixed, moving and simulated radar targets illustrating practical radar performance testing scenarios. This setup consists of MBX32 compact benchtop anechoic chamber with WLL09 instrumented wall, GIM04H-300X, 3 Axis antenna positioner, stationary trihedral corner reflectors, and Eravant STR-793-12-D1 77GHz radar target simulator. This demonstration highlights the versatility and modularity of MilliBox Radar Test Systems for everyday radar characterization and tuning in mmWave and sub-THz domain.

MilliBox showcases its best value MBX02K antenna test system when used in broadband configuration using the Anritsu ME7838 VectorStar VNA operating from 14GHz to 110GHz measuring a dual ridge Antenna from Eravant. This demonstrates the incredible versatility of MilliBox system for a wide variety of frequencies and applications. The system collects 97 3D radiation patterns in a single sweep covering an unprecedented 97GHz spectrum at once.

MilliBox also cooperated with Cornes RF Engineering to create an economical CATR solution for Ka-Band and V-Band. This original system uses the best of both company technologies to create a highly innovative solution for daily antenna radiation pattern capture.

This product will be featured in a live demonstration in Cornes RF Engineering booth 11057 during IMS.

mmWave Test Solutions

mmWave Test Solutions introduced the OMNI3, a high-level motion engine and command interpreter engineered from the ground up for antenna positioning. As an evolution of the current controller, the OMNI3 adds significant functionality while keeping automation programming straightforward. There is no SDK, API, or PC-OS-Python latency involved — just high-level ASCII commands over Serial-over-USB, compatible with Python, LabVIEW, C#, MATLAB, or a plain terminal. The non-blocking architecture runs asynchronous, synchronous, and continuous motion together. Axes can run alone, together, or coordinated to start and land in sync, while the controller deterministically handles all timing for measurement accuracy.

Mouser Electronics, Inc.

Mouser representatives will be at Booth #18017 to discuss top technologies, new ideas, trends, and RF solutions. Engineers can find inspiration for their next project with the newest products on display from Mouser's vast line card of over 1,200 manufacturer brands. Attendees can also discover the distributor's informative eBooks and technical resource hub. Visitors to the booth can sign up for Mouser's newsletters and new product emails, which provide exclusive technical information to support projects and help achieve a speed-to-market advantage. Patrons can also try their luck at Mouser's Forbidden Places game for a chance to win an exciting prize. 

In addition to hosting the flagship IMS convention, IEEE's Microwave Week also features the Radio Frequency Integrated Circuits (RFIC) Symposium and the Automatic RF Techniques Group (ARFTG) Conference. These co-located conferences will offer attendees the opportunity to learn from and connect with application engineers, product experts, peers, media, analysts and other industry leaders. 

Pickering Interfaces 

Pickering Interfaces will showcase its broad portfolio of RF and microwave signal switching solutions at the IEEE International Microwave Symposium (IMS) 2026, taking place June 9 –11 in Boston, Mass. Visitors to booth 14104 will see how Pickering’s COTS, configurable, and turnkey switching platforms support scalable RF and microwave test systems for applications ranging from aerospace and defense to communications, semiconductor and automotive test.

Pickering will also demonstrate its Microwave Switch Design Tool, part of the company’s recently released Test System Architect graphical toolset. The free online tool enables engineers to graphically design, configure and simulate RF and microwave switching systems, specify components such as relays, attenuators, connectors, and cables and share designs with colleagues or Pickering engineers for evaluation before manufacturing.

At IMS, Pickering will highlight its RF & microwave switching solutions, including:

• Standard COTS RF & microwave switching solutions – PXI and PXIe modules with bandwidths up to 110 GHz, including SPDT, transfer, multiplexer and matrix options, supported by PXI, PXIe and LXI/USB chassis.
• Flexible RFIU switch platforms – User-specified microwave switching solutions available in PXI and LXI formats, supporting high-performance microwave relays up to 110 GHz at 50 Ω impedance and up to 2.5 GHz at 75 Ω impedance, with a range of front-panel connector options.
•  Turnkey RFIU switch & signal routing subsystems – Custom LXI microwave switch subsystems designed to meet unique test requirements while supporting long-term system compatibility.
• Test system design software – Pickering’s Microwave Switch Design Tool, part of Test System Architect, which enables engineers to design, simulate and model flexible PXI and LXI microwave switching systems.

Pico Technology

Pico Technology announced the new PicoScope 5000E Series oscilloscopes, a new family of compact, USB-C oscilloscopes for engineers. Addressing the need to measure sensitive, low-amplitude signals and move quickly between analog, digital and mixed-signal debugging. The PicoScope 5000E Series delivers true 16-bit resolution with bandwidths up to 200 MHz, sample rates of 2.5 GSPS and 1 GS capture memory. The PicoScope 5000E Plus Series models add a switchable 8-bit high-speed mode with bandwidths up to 500 MHz, sampling rate of 5 GSPS and 2 GS of deep memory, giving engineers the advantage of a high-resolution precision oscilloscope and a faster 500 MHz debug oscilloscope in one portable instrument.

The PicoScope 5000E Series oscilloscopes are available as 4-channel or 4 + 16 channel mixed-signal oscilloscope (MSO) variants. The standard PicoScope 5000E Series is available in 60, 100 and 200 MHz bandwidth models. The Plus models expand this offering, available in 60/200 MHz, 100/350 MHz and 200/500 MHz models (reflecting their dual 16-bit/8-bit bandwidth capabilities, respectively).  

pSemi 

pSemi be showcasing their latest RF innovations engineered to deliver the performance, reliability and efficiency required for today’s most advanced applications in booth 17090. 

Visit the booth to explore solutions for: 

• Mobility & Cable Broadband 
• General Purpose RF Switches 
• Wireless Connectivity 
• Test & Measurement 
• LMR & Satcom 
• Broadband Switches 
• High Power RF Switches 
• Wireless Infrastructure. 

Qorvo

At the center of Qorvo’s IMS presence, in booth 20036, will be six live, in-booth demonstrations, marking the return of hands-on system demonstrations that showcase innovation across mmWave and Wi-Fi connectivity, SATCOM beamforming, IoT long-range amplification, 5G FWA, advanced filtering and spectrum control and GaN-based radar systems. Qorvo will also highlight its Elite360℠ Foundry & Services, a comprehensive offering that combines trusted U.S.-based manufacturing, advanced RF semiconductor technologies, packaging expertise and space product screening to support mission-critical applications.

Qorvo will play an active role across IMS and the RFIC Symposium, including:

• Multiple technical paper presentations across beamforming, GaN, filtering and system integration
• A featured SATCOM & NTN workshop, addressing next-generation satellite communications
• Partner demonstrations across the show floor, highlighting real-world system integration.

Qorvo’s new QPC6144 is a SP4T wideband switch that delivers greater than 65 dB isolation in a single device will be showcased at IMS. Complementing this capability, the QPC6122 (SP2T) and QPC6188 (SP4T) provide wideband absorptive switching across 50 MHz to 10 GHz, enabling a single platform approach to RF routing. These devices reduce component count and simplify design while maintaining low insertion loss and strong linearity across wide bandwidths for calibration paths, general signal routing and multi-band operation.

Qorvo^® also will showcase a new portfolio of silicon-on-insulator (SOI) RF switches and digital step attenuators designed for defense, aerospace and infrastructure customers. This new portfolio simplifies RF system design, reduces BOM complexity and accelerates integration in wideband systems. These new solutions address growing system demands for broader frequency coverage, agile signal routing and simplified integration — without the complexity of legacy GaAs-based RF control component approaches or multi-vendor RF control chains. 

Reactel

Stop by booth 15018 to speak with the Reactel team, including Engineering Manager Ray Hashemi and Business Development Engineer Jim Assurian, author of the well-read Maryland Filter Guy blog. While visiting with the Reactel team, pick up the new Short Form Catalog for an overview of their extensive filter portfolio. Bandpass, Lowpass, Highpass and Notch filters are available in an array of topologies such as tubular, LC, cavity, waveguide, ceramic and suspended substrate. Application-specific multiplexer and multifunction assemblies are available as well.

RLC Electronics

RLC Electronics, Inc. has recently launched a new SP9T/SP10T higher power handling switch series. These switches operate from DC-6 GHz (minm) and will handle upwards of 150W cW (previous designs limited power to 75W cW). Units exhibit low loss (0.25dB), high isolation (> 70 dB) and are designed to operate in severe environmental conditions. Switch to RLC for your electromechanical switch needs, from DC-65 GHz, SP2T-SP12T.

The SP11T Terminated Switch is a high-reliability RF coaxial switch engineered specifically for the demanding environments encountered in modern launch vehicle systems. Designed to provide precise signal routing with exceptional isolation and insertion loss, the SP11T configuration enables a single RF input to be selectively connected to one of eleven terminated output paths, ensuring unused channels remain properly matched and protected from unwanted reflections. 

Built for aerospace and defense applications, the switch is optimized for operation in harsh launch conditions including extreme vibration, mechanical shock, rapid thermal transitions, and high-altitude environments. The SP11T switch supports broadband RF and microwave frequency ranges with low insertion loss and high repeatability, making it ideal for mission-critical signal distribution and redundancy management.

RLC Electronics is manufacturing 13-section C-Band Notch (Band Reject) Filters for a UAV application. The reject band is >100dB and we utilize the gold screws on top of the unit to tune the notch bandwidth into specification.  Insertion Loss is typically less than 1dB and Power handling on this model is 50W cW. In general, RLC can support notch filter requirements up to 40 GHz.  These filters are characterized by having the reverse properties of band pass filters and are offered in multiple topologies, in both connectorized and surface mount packages.

Rohde & Schwarz

This year at the IMS2026, the Rohde & Schwarz team will showcase at booth #14035 the company’s latest innovations.In addition, Rohde & Schwarz will showcase updates for its R&S FSWP, the industry reference for phase noise testing. Besides a frequency range extension up to 56 GHz, the phase noise analyzer’s capabilities have been expanded for additive and residual phase noise measurements and the support of external high-end sources as local oscillators.

The R&S ZNB3000 will also be in the focus at the company’s booth. The VNA family set a new benchmark for general purpose vector network analyzers by combining high measurement speed and precision with exceptional RF performance with frequencies ranging from 9 kHz to 54 GHz. Now, the R&S ZNB3000 provides an economical solution for applications that extend to waveguide banded frequency ranges up to 330 GHz, combined with the respective mmWave converters like the R&S ZCxxx, as well as third party converters.

The newly released R&S BBA300 broadband solid-state amplifiers deliver up to 90 W in frequencies ranging from 380 MHz up to 18 GHz in a single 4U instrument. The R&S BBA300-DE500 and R&S BBA300-DE1000 models now cover power requirements of 500 W and 1,000 W over a frequency range from 1 to 6 GHz without band switching.

This year, Rohde & Schwarz builds on its popular 2025 IMS solution partner passport challenge with the 2026 VNA Applications Passport. Participants can learn about the many applications of their versatile VNAs by visiting some of our many solution partner booths.

Complete the challenge and win a prize! IMS2026 attendees can find Rohde & Schwarz in booth #14035 of the Thomas M. Menino Convention and Exhibition Center in Boston, Mass., from June 7 to 12, 2026. Open to all IMS show attendees, Rohde & Schwarz experts will be participating in the IMS2026 Micro App sessions and workshops from June 7 to 12.

Smiths Interconnect

Smiths Interconnect, a Molex company, invites you to visit them at IMS2026 booth #17070 to see live demonstrations and learn more about their cutting-edge connectivity solutions. Demonstrations include:

• Ceramic RF Filters providing a reliable, compact and lightweight solution available up to 6,000 MHz for radar and communications applications
• K2TVA Thermopad® temperature variable attenuators offering a totally passive solution for gain compensation over temperature with proven high-reliability heritage
• EZiCoax a single-piece, spring-loaded SMP connector operating up to 40 GHz
• LightABLE-RF™ and SpaceABLE-RF™ RF-over-Fiber (RFoF) capability utilizing an 850 nm VCSEL over multimode fiber enabling new lows in SWaP-C.

Spectrum Control 

Spectrum Control (IMS booth #20015) will be showcasing its portfolio of solutions that combine innovation, mission-specific adaptation, and production readiness to support system performance and program success. Among the products will be the mmWave dual-channel upconverters and downconverters that integrate RF+ Digital technology that brings miniaturization and integration advantages to designs. The company will also show its new D-Sub Connector Express. The latest member of the Filtered Connector Express™ family, it is a configurable connector that provides superior EMI filtering in only eight weeks with no NRE.

StratEdge 

StratEdge will showcase its complete line including post-fired ceramic packages, lower-cost molded ceramic packages and gold plated mounting tabs for extremely demanding GaAs and GaN devices. The post-fired ceramic semiconductor packages operate from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and efficient operation. The company will also be available to discuss molded ceramic package options for RF and microwave applications up to 18 GHz. StratEdge's molded ceramic packages provide designers with a broad range of high-reliability options for defense, aerospace and other harsh-environment applications.

Teledyne HiRel Semiconductors

Teledyne HiRel Semiconductors announced the TDLNA0840SEP, a space-screened, ultra-low-power, wideband low-noise amplifier (LNA) designed to support the growing demands of satellite constellations in low Earth orbit (LEO) and medium Earth orbit (MEO), spaceborne communications and advanced RF front-end architectures. 

Teledyne Storm Microwave 

Teledyne Storm Microwave will be at booth #19076. Stop by the booth to see their cables and connectors tested live with a LeCroy analyzer — a Teledyne collab, all on the show floor.

Teledyne Storm Microwave's FlatPhase™ proprietary foamed fluoropolymer dielectric eliminates typical PTFE phase change — delivering a flatter, more stable phase response across temperature extremes, humidity, and the harshest operating environments.

Teledyne brings together world-class RF, microwave, and semiconductor expertise under one roof. Find these business units on the IMS show floor:

Vaunix 

Vaunix will be exhibiting at IMS Booth #16017. Explore their latest innovations in compact Lab Brick test devices and fully integrated rack-mount Handover Test Systems — all designed to simplify your testing process and boost your product performance. Discover their growing lineup of cost-effective, portable solutions, including digital attenuators, signal generators, RF switches, phase shifters and more. Ask how their Digital Attenuator Hand Over Test Systems, can help you build a reliable, scalable microwave test bench.  Book a 1:1 meeting to discuss your specific requirements and we will provide guidance on how our solutions can best meet your testing needs. Attendees can stop by and pick up their 2026 Product Guide, with several new products.

WIPL-D 

WIPL-D develops advanced full-wave 3D electromagnetic simulation software based on the Method of Moments (MoM) with higher-order basis functions, delivering exceptional accuracy and computational efficiency for complex EM problems. Meet the WIPL-D team for live demonstrations and technical discussions on advanced EM simulation workflows and practical engineering applications.

Wupatec

Wupatec and Mitsubishi Electric will present a joint live demonstration at IEEE IMS 2026, focused on FR3 measurement workflows for 5G-Advanced and 6G applications. The setup combines Mitsubishi Electric’s GaN Doherty Power Amplifier module with Wupatec’s RFSoC-based measurement platform and FR3 Extension Board. It demonstrates how an RFSoC platform can be extended beyond its native 7 GHz range to support FR3 signal generation, acquisition, characterization and digital linearization.

What you’ll see live:

• FR3 wideband signal generation
• RF acquisition and characterization
• GaN PA testing workflow
• DPD / CFR integration
• FSoC-based measurement platform

See the demo live at Dassault Systèmes' booth #14046.