Join Analog Devices in-person at the IEEE MTT-S International Microwave Symposium (IMS) 2025 where they will be showcasing the industry's most complete, high performance digitization and processing platform.

Experience first-hand how ADI's latest RF, clocking, data converter and power solutions are working together to enable unprecedented system-level solutions for communications, instrumentation, aerospace and defense customers.

Workshops

Physics Informed Machine Learning based Digital Predistortion of RF Power Amplifiers

Date: Sunday, June 15

Time: 8:00 am – 11:50 am

Location: Room 204

Speaker: Tao Yu, Director of Machine Learning

Considering the environmental impact of radio access technologies alongside traditional performance metrics that have driven the evolution of 4G and 5G systems, it’s essential to recognize that wireless infrastructure consumes a significant portion of energy used by communication service providers.

Bringing Commercial Cellular Access to Space

Date: Sunday, June 15

Time: 8:00 am – 5:20 pm

Location: Room 208

Speaker: Mohamed Abdalla, Director, Analog/RF Design Engineering

This presentation explores the integration of 5G Non-Terrestrial Networks (NTN) with terrestrial networks, highlighting the motivation, use cases and challenges involved. It discusses the 3GPP standard for NTN integration and reviews historical technological advancements in LEO SAT applications, particularly in phased array front-end receivers and beamformer chipsets. A Ku-band phased array G/T analysis is presented to underscore the significance of technology selection, BFIC architecture and the reduction of power consumption and noise figure as key factors for commercializing 5G NTN. The presentation also covers the LEO SAT phased array developments at ADI. Overall, the presentation provides a comprehensive overview of the challenges and technical advancements in integrating 5G NTN with terrestrial networks.

RF Bootcamp

RF Bootcamp | IMS Microwave Week

Tx/Rx Communications System Digital-to-RF Design and Test

Date: Monday, June 16

Time: 8:00 am – 5:20 pm

Location: Room 212-214

Speaker: Bryan Goldstein, Corporate Vice President

This session will cover a multi-channel Tx/Rx RFMW Communications System design and how RFMW and digital domains are merging to allow advanced design and characterization techniques.

RFIC Technical Panel

Low-Earth-Orbit (LEO) Satellite Broadband: Revolutionizing Communication or Just Adding Space Debris?

Co-Organizers: Travis Forbes (Sandia National Laboratories), Salvatore Finocchiaro (Qorvo)

Date: Monday, June 16

Time: 12:00 pm – 1:30 pm

Location: Room 216

Speaker: John Cowles, Senior Director of Engineering and Technology

Large corporations are investing billions of dollars building thousands of LEO satellites to offer broadband internet services to rural and under-developed areas. In addition, many countries are jumping onto this wagon to secure their own access to the internet as part of a national security policy. On the other hand, the high satellite launch cost, hardware cost, and high monthly subscription fees do not seem to fit the objective of providing broadband access to the general earth population, many of whom are living in poverty. Come join the panel and find out if this is expensive space junk or a revolution in broadband internet access.

Industry Keynote

A MIMO Perspective of Phased Arrays and its Applications

Date: Wednesday, June 18

Time: 8:00 am pm

Location: Room 203

Speaker: John Cowles, Senior Director of Engineering and Technology

Phased arrays are most often thought of as a way to electronically focus, steer, direct and receive energy. In this traditional modality, all the antenna elements work cooperatively to illuminate and observe radar targets or to transmit and receive communications signals in a directed way. It turns out that multiple-in multiple-out (MIMO) systems have many degrees of freedom that can be explored to implement a variety of imaging, spatial spectrum analysis and energy steering systems, not to mention other radar and data transmission modalities. Extracting more value from phased arrays requires RF, analog, digital signal processing and high performance compute to be jointly optimized.

Microapps

ADF4382 Fast Calibration Feature

Date: Tuesday, June 17

Time: 10:15 am

Location: Microapps Theater, Booth 5423

Speaker: Kieran Barrett, Manager, Product Applications

In many phase-locked loop frequency generation applications, reducing lock time between frequencies is of critical importance. The ADF4382 uses a dual-core, multi-band VCO architecture that enables a wide octave frequency range from 11 GHz to 22 GHz. The default method for frequency selection uses an autocalibration routine to select the appropriate VCO core and band internally, which typically takes 100μs. This presentation details the innovative FastCal™ feature which uses an on-chip Look-up table approach, allowing users to bypass the autocalibration routine. Thereby reducing time taken to lock from one frequency to another, to effectively just loop filter settling time.

Synchronizing Systems with a High Number of ADCs/DACs

Date: Tuesday, June 17

Time: 4:30 pm

Location: Microapps Theater, Booth 5423

Speaker: Emrecan Gidik, Senior Engineer, Product Applications

Synchronizing systems with a high number of ADCs/DACs is very difficult. New features implemented in an analog PLL and a synchronizer IC can help synchronize such systems. The PLL can introduce delays on both device clock and SYSREF to compensate propagation delays, while the synchronizer measures and compensates the round-trip delays that may happen on one or two wire connections. The seminar presents how such a system may be architected using a tree or a cascade approach and how the synchronization may be achieved.

Em Plugs for RF ICs; Practical EM Models for Fast and Accurate RF Design

Date: Thursday, June 19

Time: 10:00 am

Location: Microapps Theater, Booth 5423

Speaker: Sinan Alemdar, Principal Engineer, Product Applications

Designing-in high frequency RF ICs requires special attention to proper chip to substrate transitions, including RF landing patterns, substrate/pad parasitics, and solder/wire-bond profiles:

  • Designers often struggle to replicate the RF IC performance on another substrate or transition then recommended, as traditional s-parameter models fail to capture the critical chip to substrate transitions.
  • Analog Devices, introduces a new unencrypted transition-based EM model approach, “Em-Plugs,” to the industry enabling precise performance predictions across varying substrates and transitions.
  • This approach predicts the S-parameters performance accurately at high frequencies up to 90 GHz while eliminating the need for multiple PCB iterations, resulting faster design cycles.