Visit Cadence in Booth 1843 at the International Microwave Symposium (IMS), the premier annual international meeting for RF technologists and microwave design. Stop by to:

  • See software demonstrations
  • Talk with Cadence experts
  • Catch a glimpse of Candence latest design and analysis platforms, and workflows.

Discover Cadence's complete RF/microwave full design flow, from concept to manufacturing, addressing the design and analysis of MMICs, RFICs and modules for IC packaging, power amplifiers, RF PCBs and 5G and radar systems. Cadence RF solutions, including Virtuoso Heterogeneous Integration for RF Solution, the new Virtuoso Studio RF platform, Microwave Office software, Visual System Simulator, Clarity 3D Solver, Celsius Studio Thermal Solver and EMX 3D Planar Solver, maximize advanced-node process benefits and streamline advanced IC package and module design implementation, verification and multiphysics analysis to speed development of RF/mmWave components and systems.

Related Resources

Quick-Turn Customized RF Test Cables
4G/5G RF Combiner
High Velocity Cable Assemblies: ACH Series

Learn about the latest solutions for high frequency design, analysis and manufacturing signoff, including:

  • Heterogeneous technology integration solutions
  • RFIC design, simulation and signoff
  • Si MMIC design
  • III-V MMIC, PCB, and multi-chip module (MCM) design
  • Communication and radar system design
  • 3D EM Analysis – Antennas, ICs, packages and PCBs
  • Thermal Analysis – ICs, PCB and packages
  • AI/ML solutions for RF to mmWave design

Sunday, June 15 - (All times Pacific)

  • Workshop Room 210
    • 8:00 – 17:20 - WSH-5: Bits to Beams: How do You Simulate a Heterogeneously Packaged, Digitally Steered Phased Array? Speaker: Paul Mosinskis

Tuesday, June 17 - (All times Pacific)

  • Industry Workshop in Room 204
    • 10:10 - 11:50 – IWTU3: System Budgeting to System Realization – A 14 nm FinFET 48GHz FEM for Next-Generation 5G/6G Applications - Speakers: RItabrata Bhattacharya, Gent Paparisto, David Vye | Location: 204
    • 13:30 - 15:10 - IWTU5: Multi-chip Modules with 3D IC Implementations, Designing for the Next Wave of Innovation - Speaker: Michael Thompson, Cadence
  • MicroApps Theater in Booth 5423
    • 13:45 - 14:00 - TUMA15: In-Design Multiphysics Analysis For Assessing, Validating, and Mitigating Ther-mal Impacts of Semiconductor Devices - Speaker: Ken Mays, Boeing Company
    • 16:45 - 17:00 – TUMA27: Closing the Gap of 3D IC Physical Design Challenges in RF Heterogeneous Inte-gration - Speaker: Kerry Judd, Cadence

Wednesday, June 18 - (All times Pacific)

  • Industry Workshop Room 204
    • 13:30 - 15:10 - IWWE4: Circuit and 3D Electromagnetic Co-Design, Synthesis, and Simulation for RF Ap-plications - Speakers: Moein Nazari, Dustin Hoekstra, Ben Held, Cadence
  • MicroApps Theater in Booth 5423
    • 15:45 - 16:00 - WEMA23: Integrating System Simulation Testbenches with Virtuoso Design Link Designs – Speaker: Gent Paparisto, Cadence
    • 16:15 - 16:30 - WEMA25: A Machine Learning Generative AI Approach for Antenna Design and Topology Optimization – Speakers: Moein Nazari, Xiaobo Wong, Suomin Cu, Cadence

Thursday, June 19 - (All times Pacific)

  • MicroApps Theater in Booth 5423
    • 10:15 - 10:30 - THMA4: RF to mmWave Heterogeneous Design and Analysis of III/V and Silicon MMICs - Speaker: Dustin Hoekstra