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At IMS, discover Cadence's
complete RF/microwave full design flow, from concept to manufacturing, addressing the design and analysis of MMICs, RFICs and modules for IC packaging, power amplifiers, RF PCBs and 5G and radar systems
AWR Design Environment® software will be showcased as part of Cadence® RF and systems offerings at the European Microwave Week 2020 virtual conference and exhibition, being presented January 10-14, with on-demand viewing through February 5.
A new application note overviews the latest high performance electromagnetic (EM) remote and parallel computing features for circuit simulations within Cadence® AWR Design Environment® software.
Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.
