Mercury Systems Inc. announced it received a $14 million order from a leading defense prime contractor to provide system-in-package (SiP) assemblies for an airborne secure processing application. The order was received in the company’s fiscal 2022 third quarter and is expected to be delivered over the next several quarters.
Mercury’s leadership in trusted microelectronics, as exemplified by its revolutionary SiP technology, is enabling new sensor processing applications for a variety of defense platforms and programs while the secure and trusted chip-scale open system architecture directly addresses the Department of Defense’s (DoD’s) requirement for onshore manufacturing of critical, state-of-the-art microelectronics.
“Developing these advanced SiP assemblies in the U.S. is another example of how Mercury is making commercial technology profoundly more accessible to defense,” said Roger Wells, president, Mercury Microelectronics. “Our significant investments in onshore trusted, microelectronics and expertise in secure, heterogeneous packaging are enabling Mercury to deliver complex solutions to our customers to meet the evolving demands of today’s defense environments and DoD requirements.”