This panel of experts will discuss a new generation of products enabled by additive manufacturing or 3D printing that are able to achieve shapes and materials properties that are not available from traditional manufacturing techniques. From PCBs to connectors to antennas to waveguides, many new additive manufacturing processes are creating lighter, smaller and better performing products than traditional processes in shapes that we not previously possible to realize.
Sponsored by: Fortify, CAES, Rogers, Boston Micro Fabrication and Nano Dimension
This panel will discuss the various RF architectures and antenna technologies being developed to produce low-cost mmWave beam steering arrays for 5G applications including fixed wireless access and cellular repeaters. Panelists will debate and discuss the best architectures, semiconductor platforms and antenna solutions including performance achieved by their products and partners to date in the market.
Sponsored by: Anokiwave, Wilson Electronics, TMYTEK, Meta Materials Inc., Pivotal Commware
This panel will discuss the various RF architectures and antenna technologies being developed to produce low-cost beam steering arrays for SATCOM applications. Panelists will debate and discuss the best RF architectures and antenna solutions including performance achieved by their products and partners to date in the market.
Sponsored by: Anokiwave, Mixcomm, Rohde & Schwarz, Ball Aerospace and CesiumAstro
This panel will discuss new power amplifier innovations such as AI/ML in amplifier optimization, high efficiency designs, new thermal solutions, linearization and DPD methods, new materials/substrates, GaN on Si versus GaN on SiC versus GaAs, and power combing technology.
Sponsored by: Rohde & Schwarz, EliteRF, AltumRF, NXP, Renesas
This panel will discuss the best device and component solutions for New Space applications that maximize performance and minimize cost/power consumption available from semiconductor companies along with the best test/measurement solutions to verify their performance. They will address the main challenges in these areas along with solutions being introduced to meet industry demands.
Sponsored by: Rohde & Schwarz, Pickering Test, Knowles, Skyworks, Smiths
This panel of device and test/measurement experts will discuss the future trends in military radar technology such as high voltage GaN, AI/ML in radar, cognitive radar, DRFM developments, new phased array architectures, increased processing power, new thermal management techniques and materials, open architectures, dual purpose radar/comms system, etc.
Sponsored by: Rohde & Schwarz, Mercury, ISL, CAES, Qorvo
This panel will discuss the upcoming UWB capabilities being added to mobile devices that will enable new location and security applications including how UWB devices are being designed and tested to meet these new capabilities. New applications that sense a person’s position and automatically adjust and secure their environment will be discussed.
Sponsored by: Qorvo, FiRa, NXP Semiconductors and Litepoint
This panel of device and test/measurement experts will discuss the state of the art in automotive radar sensors for ADAS, autonomy and interior sensing for various features being added to future vehicles. Device manufacturers will discuss the latest innovations to achieve highly integrated, low-cost 4D imaging sensors and test/measurement companies will address the challenges to testing high frequency, broadband devices for verification and reliability.
Sponsored by: Altair, Anritsu and Uhnder
Oct: No Panel Session due to EDI CON Online Every Wed.
Nov 16: Interesting IoT Technologies for the Future
This panel will explore some of the interesting IoT technologies being enabled by 5G and low power networks such as agriculture applications, drone and autonomous systems, autonomous vehicles, medical applications, security/safety and more. New developments in component design and test for low power operation will be covered.
Sponsored by: Noffz
Dec 14: Upper mmWave and THz Communications Technology for 6G
This panel of experts will discuss the future of communications systems using higher frequencies targeted for 6G deployments. They will review and debate the best devices and architectures for these systems and the test challenges that need to be solved to measure and evaluate them.
Sponsored by: Smiths, VDI