pSemi® Corporation announced its top-selling UltraCMOS® PE42424, a single-pole, double-throw RF switch supports the latest Wi-Fi 6E and ultra-wideband (UWB) standards and technology. Designed to enhance next-generation carrier and enterprise connectivity products, the PE42424 offers high linearity, fast switching and optimal isolation up to 8.5 GHz. In a compact 1.5 x 1.5 mm form factor, it exceeds the power and performance requirements of 802.11ax Wi-Fi and UWB technologies.
Unlike Wi-Fi 6, which only supported devices that operated up to 6 GHz, Wi-Fi 6E is extended up to 7.125 GHz, providing more seamless connections, faster data rates and transmission accuracy to the wireless ecosystem. The PE42424 delivers a frequency range up to 8.5 GHz to accommodate the increasing demand for reliable UWB technology, while remaining fully compliant for use in Wi-Fi 6 applications at 2.4 GHz and 5 GHz bands for maximum application flexibility.
"The semiconductor industry has seen a marked increase in device designers taking advantage of UWB technology, from location detection and radar to proximity sensing, and the extended frequency range of Wi-Fi 6E," said Vikas Choudhary, vice president of sales and marketing at pSemi Corporation. "pSemi has sold over 25 million units of the PE42424, and this high performance switch will continue being an ideal solution for existing and emerging connectivity technologies, such as Wi-Fi 7."
Product Features and Capability
The PE42424 delivers high linearity levels of 61 dBm IIP3 and 125 dBm IIP2 and fast switching of 145 nanoseconds at up to a 125 kHz switching rate to ensure the highest levels of signal routing performance and transmit signal integrity in Wi-Fi 6E and UWB applications. Additionally, the switch provides exceptional off-port isolation levels of 48 dB at 2.4 GHz and 35 dB at 5.8 GHz and exceeds 31 dB at 7.125 GHz, enabling more reliable connections and additional spectrum capacity up to 8.5 GHz.
The PE42424 is manufactured on the pSemi patented UltraCMOS® process and offered in six-lead, 1.5 x 1.5 mm DFN packaging. At nearly half the size of competitive product offerings, the switch's compact form factor returns valuable board real estate back to the designers and system architects of next-generation connectivity products.