Cadence equips engineers developing wireless products for 5G, radar, and automotive applications with high-capacity simulation, multi-physics analysis, and design interoperability with the Virtuoso,  AWR Design Environment®, and Allegro® PCB platforms. Cadence will showcase its latest innovations that address IC through system level design (chip, package, and board) inclusive of EM and thermal analysis, specifically Clarity™ 3D Solver, Celsius® Thermal Solver, and EMX® Planar 3D Solver, for large-scale systems.